ZHCSFJ2C September   2015  – February  2019 TPS65094

PRODUCTION DATA.  

  1. 1 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2 修订历史记录
  3. 3 Device Options
    1. 3.1 OTP Comparison
  4. 4 Pin Configuration and Functions
    1.     RSK Package 64-Pin VQFN With Thermal Pad Top View
    2.     Pin Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Total Current Consumption
    6. 5.6  Electrical Characteristics: Reference and Monitoring System
    7. 5.7  Electrical Characteristics: Buck Controllers
    8. 5.8  Electrical Characteristics: Synchronous Buck Converters
    9. 5.9  Electrical Characteristics: LDOs
    10. 5.10 Electrical Characteristics: Load Switches
    11. 5.11 Digital Signals: I2C Interface
    12. 5.12 Digital Input Signals (LDOLS_EN, SWA1_EN, THERMTRIPB, PMICEN, SLP_S3B, SLP_S4B, SLP_S0B)
    13. 5.13 Digital Output Signals (IRQB, RSMRSTB, PCH_PWROK, PROCHOT)
    14. 5.14 Timing Requirements
    15. 5.15 Switching Characteristics
    16. 5.16 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Good (PGOOD)
      2. 6.3.2 Register Reset Conditions
      3. 6.3.3 SMPS Voltage Regulators
        1. 6.3.3.1 Controller Overview
        2. 6.3.3.2 Converter Overview
        3. 6.3.3.3 DVS
        4. 6.3.3.4 Current Limit
      4. 6.3.4 LDOs and Load Switches
        1. 6.3.4.1 VTT LDO
        2. 6.3.4.2 LDOA1–LDOA3
        3. 6.3.4.3 Load Switches
      5. 6.3.5 Power Sequencing and VR Control
        1. 6.3.5.1 Cold Boot
        2. 6.3.5.2 Cold OFF
        3. 6.3.5.3 Connected Standby Entry and Exit
        4. 6.3.5.4 S0 to S3 Entry and Exit
        5. 6.3.5.5 S0 to S4/5 Entry and Exit
        6. 6.3.5.6 Emergency Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Off Mode
      2. 6.4.2 Standby Mode
      3. 6.4.3 Active Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 F/S-Mode Protocol
    6. 6.6 Register Maps
      1. 6.6.1  VENDORID: PMIC Vendor ID Register (offset = 00h) [reset = 0010 0010]
        1. Table 6-12 VENDORID Register Field Descriptions
      2. 6.6.2  DEVICEID: PMIC Device and Revision ID Register (offset = 01h) [reset = OTP Dependent]
        1. Table 6-13 DEVICEID Register Field Descriptions
      3. 6.6.3  IRQ: PMIC Interrupt Register (offset = 02h) [reset = 0000 0000]
        1. Table 6-14 IRQ Register Field Descriptions
      4. 6.6.4  IRQ_MASK: PMIC Interrupt Mask Register (offset = 03h) [reset = 1111 1111]
        1. Table 6-15 IRQ_MASK Register Field Descriptions
      5. 6.6.5  PMICSTAT: PMIC Status Register (offset = 04h) [reset = 0000 0000]
        1. Table 6-16 PMICSTAT Register Field Descriptions
      6. 6.6.6  OFFONSRC: PMIC Power Transition Event Register (offset = 05h) [reset = 0000 0000]
        1. Table 6-17 OFFONSRC Register Field Descriptions
      7. 6.6.7  BUCK1CTRL: BUCK1 Control Register (offset = 20h) [reset = 0011 1000]
        1. Table 6-18 BUCK1CTRL Register Field Descriptions
      8. 6.6.8  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = 0000 0000]
        1. Table 6-19 BUCK2CTRL Register Field Descriptions
      9. 6.6.9  BUCK3CTRL: BUCK3 Control Register (offset = 23h) [reset = 0001 0001]
        1. Table 6-20 BUCK3CTRL Register Field Descriptions
      10. 6.6.10 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = 0011 1101]
        1. Table 6-21 BUCK4CTRL Register Field Descriptions
      11. 6.6.11 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = 0011 1101]
        1. Table 6-22 BUCK5CTRL Register Field Descriptions
      12. 6.6.12 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = 0011 1101]
        1. Table 6-23 BUCK6CTRL Register Field Descriptions
      13. 6.6.13 DISCHCNT1: Discharge Control1 Register (offset = 40h) [reset = 0101 0101]
        1. Table 6-24 DISCHCNT1 Register Field Descriptions
      14. 6.6.14 DISCHCNT2: Discharge Control2 Register (offset = 41h) [reset = 0101 0101]
        1. Table 6-25 DISCHCNT2 Register Field Descriptions
      15. 6.6.15 DISCHCNT3: Discharge Control3 Register (offset = 42h) [reset = 0000 0101]
        1. Table 6-26 DISCHCNT3 Register Field Descriptions
      16. 6.6.16 POK_DELAY: PCH_PWROK Delay Register (offset = 43h) [reset = 0000 0111]
        1. Table 6-27 POK_DELAY Register Field Descriptions
      17. 6.6.17 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0000 0000]
        1. Table 6-28 FORCESHUTDN Register Field Descriptions
      18. 6.6.18 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = 0010 1111]
        1. Table 6-29 BUCK4VID Register Field Descriptions
      19. 6.6.19 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = 0100 1011]
        1. Table 6-30 BUCK5VID Register Field Descriptions
      20. 6.6.20 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = OTP Dependent]
        1. Table 6-31 BUCK6VID Register Field Descriptions
      21. 6.6.21 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = OTP Dependent]
        1. Table 6-32 LDOA2VID Register Field Descriptions
      22. 6.6.22 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = OTP Dependent]
        1. Table 6-33 LDOA3VID Register Field Descriptions
      23. 6.6.23 VR_CTRL1: BUCK1-3 Control Register (offset = 9Ch) [reset = 0000 0111]
        1. Table 6-34 VR_CTRL1 Register Field Descriptions
      24. 6.6.24 VR_CTRL2: VR Enable Register (offset = 9Eh) [reset = 0000 0000]
        1. Table 6-35 VR_CTRL2 Register Field Descriptions
      25. 6.6.25 VR_CTRL3: VR Enable/Disable Register (offset = 9Fh) [reset = 0111 0000]
        1. Table 6-36 VR_CTRL3 Register Field Descriptions
      26. 6.6.26 GPO_CTRL: GPO Control Register (offset = A1h) [reset = 0010 0000]
        1. Table 6-37 GPO_CTRL Register Field Descriptions
      27. 6.6.27 PWR_FAULT_MASK1: VR Power Fault Mask1 Register (offset = A2h) [reset = 1100 0000]
        1. Table 6-38 PWR_FAULT_MASK1 Register Field Descriptions
      28. 6.6.28 PWR_FAULT_MASK2: VR Power Fault Mask2 Register (offset = A3h) [reset = 0011 0111]
        1. Table 6-39 PWR_FAULT_MASK2 Register Field Descriptions
      29. 6.6.29 DISCHCNT4: Discharge Control4 Register (offset = ADh) [reset = 0110 0001]
        1. Table 6-40 DISCHNT4 Register Field Descriptions
      30. 6.6.30 LDOA1CTRL: LDOA1 Control Register (offset = AEh) [reset = OTP Dependent]
        1. Table 6-41 LDOA1CTRL Register Field Descriptions
      31. 6.6.31 PG_STATUS1: Power Good Status1 Register (offset = B0h) [reset = 0000 0000]
        1. Table 6-42 PG_STATUS1 Register Field Descriptions
      32. 6.6.32 PG_STATUS2: Power Good Status2 Register (offset = B1h) [reset = 0000 0000]
        1. Table 6-43 PG_STATUS2 Register Field Descriptions
        2. 6.6.32.1   PWR_FAULT_STATUS1: Power Fault Status1 Register (offset = B2h) [reset = 0000 0000]
          1. Table 6-44 PWR_FAULT_STATUS1 Register Field Descriptions
        3. 6.6.32.2   PWR_FAULT_STATUS2: Power Fault Status2 Register (offset = B3h) [reset = 0000 0000]
          1. Table 6-45 PWR_FAULT_STATUS2 Register Field Descriptions
      33. 6.6.33 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0000 0000]
        1. Table 6-46 TEMPHOT Register Field Descriptions
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Controller Design Procedure
          1. 7.2.2.1.1 Selecting the Output Capacitors
          2. 7.2.2.1.2 Selecting the Inductor
          3. 7.2.2.1.3 Selecting the FETs
          4. 7.2.2.1.4 Bootstrap Capacitor
          5. 7.2.2.1.5 Selecting the Input Capacitors
            1. 7.2.2.1.5.1 Setting the Current Limit
        2. 7.2.2.2 Converter Design Procedure
          1. 7.2.2.2.1 Selecting the Inductor
          2. 7.2.2.2.2 Selecting the Output Capacitors
          3. 7.2.2.2.3 Selecting the Input Capacitors
        3. 7.2.2.3 LDO Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Specific Application for TPS650944
    4. 7.4 Do's and Don'ts
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10器件和文档支持
    1. 10.1 器件支持
      1. 10.1.1 第三方产品免责声明
      2. 10.1.2 开发支持
    2. 10.2 文档支持
      1. 10.2.1 相关文档
    3. 10.3 接收文档更新通知
    4. 10.4 社区资源
    5. 10.5 商标
    6. 10.6 静电放电警告
    7. 10.7 Glossary
  11. 11机械、封装和可订购信息
    1. 11.1 Package Option Addendum
      1. 11.1.1 Packaging Information
      2. 11.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3.5 Power Sequencing and VR Control

When a valid power source is available at VSYS (VSYS ≥ 5.6 V), internal analog blocks including LDO5 and LDO3P3 are enabled. For part numbers with LDOA1 set as an always on rail, the PMIC leaves reset and I2C communication is available as soon as LDO3P3 and LDO5 power goods are confirmed. For part numbers with LDOA1 set as a general-purpose LDO, the PMIC remains in reset until PMICEN is set high. Five input pins of the TPS65094x device are driven by a host or by external-controller (EC) defined power states that transition from one to another in sequence.

Table 6-8 shows various system-level power states. Also, Table 6-9 summarizes a list of active rails in each power state. The sequencing for the transitions between these states is described in the following sections.

If a rail is either disabled by I2C or OTP programming, then it is not enabled by the following sequences. For example, VTT LDO is not enabled for LPDDR4 OTPs.

Table 6-8 Power State and Corresponding I/O Status

POWER STATE SIGNALS TO PMIC SIGNALS FROM PMIC
PMICEN SLP_S4B(1) SLP_S3B(1) SLP_S0B(2) THERMTRIPB(3) RSMRSTB PCH_PWROK
G3 0 0 0 0 0 0 0
S4/S5 1 0 0 1 1 1 0
S3 1 1 0 1 1 1 0
S0iX 1 1 1 0 1 1 1
S0 1 1 1 1 1 1 1
(1) When PMIC is first enabled, SLP_S4B and SLP_S3B are to be treated as if they are low (actual state of signal ignored) until the deassertion of RSMRSTB (L → H).
(2) When PMIC is first enabled, SLP_S0B are to be treated as if they are high (actual state of signal ignored) until the assertion of PCH_PWROK (L → H).
(3) THERMTRIPB is to be treated as if it is high (actual state of signal ignored) until the deassertion of RSMRSTB (L → H).

Table 6-9 Active Rails in Each Power State

POWER STATE ACTIVE RAILS
S4/S5 BUCK1 (VNN), BUCK4 (V1P8A), BUCK5 (V1P24A)
S3 Rails in S4/S5 + SWB1_2 (V1P8U)(1), BUCK6 (VDDQ)
S0 Rails in S3 + SWB1_2(2), VTT, BUCK2 (VCCGI), BUCK3 (VCCRAM)
S0iX Rails in S0 – BUCK1 (VNN), BUCK2 (VCCGI), BUCK3 (VCCRAM), VTT
(1) For LPDDR3 and LPDDR4
(2) For DDR3L