ZHCSFJ2C September   2015  – February  2019 TPS65094

PRODUCTION DATA.  

  1. 1 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2 修订历史记录
  3. 3 Device Options
    1. 3.1 OTP Comparison
  4. 4 Pin Configuration and Functions
    1.     RSK Package 64-Pin VQFN With Thermal Pad Top View
    2.     Pin Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Total Current Consumption
    6. 5.6  Electrical Characteristics: Reference and Monitoring System
    7. 5.7  Electrical Characteristics: Buck Controllers
    8. 5.8  Electrical Characteristics: Synchronous Buck Converters
    9. 5.9  Electrical Characteristics: LDOs
    10. 5.10 Electrical Characteristics: Load Switches
    11. 5.11 Digital Signals: I2C Interface
    12. 5.12 Digital Input Signals (LDOLS_EN, SWA1_EN, THERMTRIPB, PMICEN, SLP_S3B, SLP_S4B, SLP_S0B)
    13. 5.13 Digital Output Signals (IRQB, RSMRSTB, PCH_PWROK, PROCHOT)
    14. 5.14 Timing Requirements
    15. 5.15 Switching Characteristics
    16. 5.16 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Good (PGOOD)
      2. 6.3.2 Register Reset Conditions
      3. 6.3.3 SMPS Voltage Regulators
        1. 6.3.3.1 Controller Overview
        2. 6.3.3.2 Converter Overview
        3. 6.3.3.3 DVS
        4. 6.3.3.4 Current Limit
      4. 6.3.4 LDOs and Load Switches
        1. 6.3.4.1 VTT LDO
        2. 6.3.4.2 LDOA1–LDOA3
        3. 6.3.4.3 Load Switches
      5. 6.3.5 Power Sequencing and VR Control
        1. 6.3.5.1 Cold Boot
        2. 6.3.5.2 Cold OFF
        3. 6.3.5.3 Connected Standby Entry and Exit
        4. 6.3.5.4 S0 to S3 Entry and Exit
        5. 6.3.5.5 S0 to S4/5 Entry and Exit
        6. 6.3.5.6 Emergency Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Off Mode
      2. 6.4.2 Standby Mode
      3. 6.4.3 Active Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 F/S-Mode Protocol
    6. 6.6 Register Maps
      1. 6.6.1  VENDORID: PMIC Vendor ID Register (offset = 00h) [reset = 0010 0010]
        1. Table 6-12 VENDORID Register Field Descriptions
      2. 6.6.2  DEVICEID: PMIC Device and Revision ID Register (offset = 01h) [reset = OTP Dependent]
        1. Table 6-13 DEVICEID Register Field Descriptions
      3. 6.6.3  IRQ: PMIC Interrupt Register (offset = 02h) [reset = 0000 0000]
        1. Table 6-14 IRQ Register Field Descriptions
      4. 6.6.4  IRQ_MASK: PMIC Interrupt Mask Register (offset = 03h) [reset = 1111 1111]
        1. Table 6-15 IRQ_MASK Register Field Descriptions
      5. 6.6.5  PMICSTAT: PMIC Status Register (offset = 04h) [reset = 0000 0000]
        1. Table 6-16 PMICSTAT Register Field Descriptions
      6. 6.6.6  OFFONSRC: PMIC Power Transition Event Register (offset = 05h) [reset = 0000 0000]
        1. Table 6-17 OFFONSRC Register Field Descriptions
      7. 6.6.7  BUCK1CTRL: BUCK1 Control Register (offset = 20h) [reset = 0011 1000]
        1. Table 6-18 BUCK1CTRL Register Field Descriptions
      8. 6.6.8  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = 0000 0000]
        1. Table 6-19 BUCK2CTRL Register Field Descriptions
      9. 6.6.9  BUCK3CTRL: BUCK3 Control Register (offset = 23h) [reset = 0001 0001]
        1. Table 6-20 BUCK3CTRL Register Field Descriptions
      10. 6.6.10 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = 0011 1101]
        1. Table 6-21 BUCK4CTRL Register Field Descriptions
      11. 6.6.11 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = 0011 1101]
        1. Table 6-22 BUCK5CTRL Register Field Descriptions
      12. 6.6.12 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = 0011 1101]
        1. Table 6-23 BUCK6CTRL Register Field Descriptions
      13. 6.6.13 DISCHCNT1: Discharge Control1 Register (offset = 40h) [reset = 0101 0101]
        1. Table 6-24 DISCHCNT1 Register Field Descriptions
      14. 6.6.14 DISCHCNT2: Discharge Control2 Register (offset = 41h) [reset = 0101 0101]
        1. Table 6-25 DISCHCNT2 Register Field Descriptions
      15. 6.6.15 DISCHCNT3: Discharge Control3 Register (offset = 42h) [reset = 0000 0101]
        1. Table 6-26 DISCHCNT3 Register Field Descriptions
      16. 6.6.16 POK_DELAY: PCH_PWROK Delay Register (offset = 43h) [reset = 0000 0111]
        1. Table 6-27 POK_DELAY Register Field Descriptions
      17. 6.6.17 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0000 0000]
        1. Table 6-28 FORCESHUTDN Register Field Descriptions
      18. 6.6.18 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = 0010 1111]
        1. Table 6-29 BUCK4VID Register Field Descriptions
      19. 6.6.19 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = 0100 1011]
        1. Table 6-30 BUCK5VID Register Field Descriptions
      20. 6.6.20 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = OTP Dependent]
        1. Table 6-31 BUCK6VID Register Field Descriptions
      21. 6.6.21 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = OTP Dependent]
        1. Table 6-32 LDOA2VID Register Field Descriptions
      22. 6.6.22 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = OTP Dependent]
        1. Table 6-33 LDOA3VID Register Field Descriptions
      23. 6.6.23 VR_CTRL1: BUCK1-3 Control Register (offset = 9Ch) [reset = 0000 0111]
        1. Table 6-34 VR_CTRL1 Register Field Descriptions
      24. 6.6.24 VR_CTRL2: VR Enable Register (offset = 9Eh) [reset = 0000 0000]
        1. Table 6-35 VR_CTRL2 Register Field Descriptions
      25. 6.6.25 VR_CTRL3: VR Enable/Disable Register (offset = 9Fh) [reset = 0111 0000]
        1. Table 6-36 VR_CTRL3 Register Field Descriptions
      26. 6.6.26 GPO_CTRL: GPO Control Register (offset = A1h) [reset = 0010 0000]
        1. Table 6-37 GPO_CTRL Register Field Descriptions
      27. 6.6.27 PWR_FAULT_MASK1: VR Power Fault Mask1 Register (offset = A2h) [reset = 1100 0000]
        1. Table 6-38 PWR_FAULT_MASK1 Register Field Descriptions
      28. 6.6.28 PWR_FAULT_MASK2: VR Power Fault Mask2 Register (offset = A3h) [reset = 0011 0111]
        1. Table 6-39 PWR_FAULT_MASK2 Register Field Descriptions
      29. 6.6.29 DISCHCNT4: Discharge Control4 Register (offset = ADh) [reset = 0110 0001]
        1. Table 6-40 DISCHNT4 Register Field Descriptions
      30. 6.6.30 LDOA1CTRL: LDOA1 Control Register (offset = AEh) [reset = OTP Dependent]
        1. Table 6-41 LDOA1CTRL Register Field Descriptions
      31. 6.6.31 PG_STATUS1: Power Good Status1 Register (offset = B0h) [reset = 0000 0000]
        1. Table 6-42 PG_STATUS1 Register Field Descriptions
      32. 6.6.32 PG_STATUS2: Power Good Status2 Register (offset = B1h) [reset = 0000 0000]
        1. Table 6-43 PG_STATUS2 Register Field Descriptions
        2. 6.6.32.1   PWR_FAULT_STATUS1: Power Fault Status1 Register (offset = B2h) [reset = 0000 0000]
          1. Table 6-44 PWR_FAULT_STATUS1 Register Field Descriptions
        3. 6.6.32.2   PWR_FAULT_STATUS2: Power Fault Status2 Register (offset = B3h) [reset = 0000 0000]
          1. Table 6-45 PWR_FAULT_STATUS2 Register Field Descriptions
      33. 6.6.33 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0000 0000]
        1. Table 6-46 TEMPHOT Register Field Descriptions
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Controller Design Procedure
          1. 7.2.2.1.1 Selecting the Output Capacitors
          2. 7.2.2.1.2 Selecting the Inductor
          3. 7.2.2.1.3 Selecting the FETs
          4. 7.2.2.1.4 Bootstrap Capacitor
          5. 7.2.2.1.5 Selecting the Input Capacitors
            1. 7.2.2.1.5.1 Setting the Current Limit
        2. 7.2.2.2 Converter Design Procedure
          1. 7.2.2.2.1 Selecting the Inductor
          2. 7.2.2.2.2 Selecting the Output Capacitors
          3. 7.2.2.2.3 Selecting the Input Capacitors
        3. 7.2.2.3 LDO Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Specific Application for TPS650944
    4. 7.4 Do's and Don'ts
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10器件和文档支持
    1. 10.1 器件支持
      1. 10.1.1 第三方产品免责声明
      2. 10.1.2 开发支持
    2. 10.2 文档支持
      1. 10.2.1 相关文档
    3. 10.3 接收文档更新通知
    4. 10.4 社区资源
    5. 10.5 商标
    6. 10.6 静电放电警告
    7. 10.7 Glossary
  11. 11机械、封装和可订购信息
    1. 11.1 Package Option Addendum
      1. 11.1.1 Packaging Information
      2. 11.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.1 Layout Guidelines

For a detailed description regarding layout recommendations, refer to the TPS65094x Design Guide and to the TPS65094x Schematic Checklist, Layout Checklist, and ILIM Calculator Tool. For all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator can have stability problems and EMI issues. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input capacitors, output capacitors, and inductors must be placed as close as possible to the device. Use a common-ground node for power ground and use a different, isolated node for control ground to minimize the effects of ground noise. Connect these ground nodes close to the AGND pin by one or two vias. Use of the design guide is highly encouraged in addition to the following list of other basic requirements:

  • Do not allow the AGND, PGNDSNSx, or FBGND2 to connect to the thermal pad on the top layer.
  • To ensure proper sensing based on FET RDSON, PGNDSNSx must not connect to PGND until very close to the PGND pin of the FET.
  • All inductors, input/output capacitors, and FETs for the converters and controller must be on the same board layer as the device.
  • To achieve the best regulation performance, place feedback connection points near the output capacitors and minimize the control feedback loop as much as possible.
  • Bootstrap capacitors must be placed close to the device.
  • The input and output capacitors of the internal reference regulators must be placed close to the device pins.
  • Route DRVHx and SWx as a differential pair. Ensure that there is a PGND path routed in parallel with DRVLx, which provides optimal driver loops.