ZHCSHG3B november   2017  – july 2020 TPS254900A-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
    1.     7
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  FAULT Response
      2. 8.3.2  Cable Compensation
        1. 8.3.2.1 Design Procedure
      3. 8.3.3  D+ and D– Protection
      4. 8.3.4  VBUS OVP Protection
      5. 8.3.5  Output and D+ or D– Discharge
      6. 8.3.6  Port Power Management (PPM)
        1. 8.3.6.1 Benefits of PPM
        2. 8.3.6.2 PPM Details
        3. 8.3.6.3 Implementing PPM in a System With Two Charging Ports (CDP and SDP1)
      7. 8.3.7  Overcurrent Protection
      8. 8.3.8  Undervoltage Lockout
      9. 8.3.9  Thermal Sensing
      10. 8.3.10 Current-Limit Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Truth Table (TT)
      2. 8.4.2 USB BC1.2 Specification Overview
      3. 8.4.3 Standard Downstream Port (SDP) Mode — USB 2.0 and USB 3.0
      4. 8.4.4 Charging Downstream Port (CDP) Mode
      5. 8.4.5 Client Mode
      6. 8.4.6 High-Bandwidth Data-Line Switch
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Capacitance
        2. 9.2.2.2 Output Capacitance
        3. 9.2.2.3 BIAS Capacitance
        4. 9.2.2.4 Output and BIAS TVS
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RVC|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
BIAS 12 PWR Used for IEC protection. Typically, connect a 2.2-µF capacitor and a transient-voltage suppressor (TVS) to ground and 5.1 kΩ to OUT.
CS 6 O Linear cable compensation current. Connect to divider resistor of front-end dc-dc converter.
CTL1 8 I Logic-level control input for controlling the charging mode and the signal switches; see the Device Truth Table (TT).
CTL2 9 I Logic-level control input for controlling the charging mode and the signal switches; see the Device Truth Table (TT).
DM_IN 14 I/O D– data line to downstream connector
DM_OUT 4 I/O D– data line to upstream USB host controller
DP_IN 13 I/O D+ data line to downstream connector
DP_OUT 5 I/O D+ data line to upstream USB host controller
EN 7 I Logic-level control input for turning the power and signal switches on or off. When EN is low, the device is disabled, and the signal and power switches are OFF.
FAULT 18 O Active-low, open-drain output, asserted during overtemperature, overcurrent, and overvoltage conditions.
GND 11 Ground connection; should be connected externally to the thermal pad.
ILIM_HI 20 I External resistor used to set the high current-limit threshold.
ILIM_LO 19 I External resistor used to set the low current-limit threshold and the load-detection current threshold.
IMON 1 O This pin sources a scaled-down ratio of current through the internal FET. A resistor from this pin to GND converts current to proportional voltage; used as an analog current monitor.
IN 2,3 PWR Input supply voltage; connect a 0.1-µF or greater ceramic capacitor from IN to GND as close to the IC as possible.
OUT 15,16 PWR Power-switch output
OVP_SEL 10 I Logic-level control input for choosing the OUT overvoltage threshold. When OVP_SEL is low, V(OV_OUT_LOW) is active. When OVP_SEL is high, V(OV_OUT_HIGH) is active.
STATUS 17 O Active-low open-drain output, asserted in load-detect conditions
Thermal pad Thermal pad on the bottom of the package
I = Input, O = Output, I/O = Input and output, PWR = Power