SCAS339T March   1994  – May 2024 SN74LVC126A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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4 Pin Configuration and Functions

SN74LVC126A SN74LVC126A D, DB, DGV, NS, or PW Package;14-Pin SOIC, SSOP, TVSOP, SOP or TSSOP (Top View)Figure 4-1 SN74LVC126A D, DB, DGV, NS, or PW Package;14-Pin SOIC, SSOP, TVSOP, SOP or TSSOP (Top View)
SN74LVC126A SN74LVC126A BQA or RGY Package;14-Pin WQFN or VQFN (Top View)Figure 4-2 SN74LVC126A BQA or RGY Package;14-Pin WQFN or VQFN (Top View)
Table 4-1 Pin Functions
PIN I/O(1) DESCRIPTION
NO. NAME
1 1OE I Output enable 1
2 1A I Gate 1 input
3 1Y O Gate 1 output
4 2OE I Output enable 2
5 2A I Gate 2 input
6 2Y O Gate 2 output
7 GND — Ground pin
8 3Y O Gate 3 output
9 3A I Gate 3 input
10 3OE I Output enable 3
11 4Y O Gate 4 output
12 4A I Gate 4 input
13 4OE I Output Enable 4
14 VCC — Power pin
Thermal pad — Connect the GND pin to the exposed thermal pad for correct operation. Connect the thermal pad to any internal PCB ground plane using multiple vias for good thermal performance.
(1) I = input, O = output, P = power, FB = feedback, GND = ground, N/A = not applicable