6.4 Thermal Information
THERMAL METRIC(1)
|
LMR14010A |
UNIT |
SOT (DDC) |
6 PINS |
RθJA
|
Junction-to-ambient thermal resistance |
102 |
°C/W |
RθJC(top)
|
Junction-to-case (top) thermal resistance |
36.9 |
ψJB
|
Junction-to-board characterization parameter |
28.4 |
(1) All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, number of thermal vias, board size, ambient temperature, and air flow.