ZHCSIZ1G May   2010  – November 2018 LM98640QML-SP

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings    
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information         
    5. 6.5 Quality Conformance Inspection
    6. 6.6 LM98640QML-SP Electrical Characteristics
    7. 6.7 AC Timing Specifications
    8. 6.8 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Sampling Modes
        1. 7.3.1.1 Sample & Hold Mode
          1. 7.3.1.1.1 Sample & Hold Mode CLAMP/SAMPLE Adjust
        2. 7.3.1.2 CDS Mode
          1. 7.3.1.2.1 CDS Mode Bimodal Offset
          2. 7.3.1.2.2 CDS Mode CLAMP/SAMPLE Adjust
      2. 7.3.2 Input Bias and Clamping
        1. 7.3.2.1 Sample and Hold Mode Biasing
        2. 7.3.2.2 CDS Mode Biasing
        3. 7.3.2.3 VCLP DAC
      3. 7.3.3 Programmable Gain
        1. 7.3.3.1 CDS/SH Stage Gain
        2. 7.3.3.2 PGA Gain Plots
      4. 7.3.4 Programmable Analog Offset Correction
      5. 7.3.5 Analog to Digital Converter
      6. 7.3.6 LVDS Output
        1. 7.3.6.1 LVDS Output Voltage
        2. 7.3.6.2 LVDS Output Modes
        3. 7.3.6.3 TXFRM Output
          1. 7.3.6.3.1 Output Mode 1 - Dual Lane
          2. 7.3.6.3.2 Output Mode 2 - Quad Lane
      7. 7.3.7 Clock Receiver
      8. 7.3.8 Power Trimming
    4. 7.4 Device Functional Mode
      1. 7.4.1 Powerdown Modes
      2. 7.4.2 LVDS Test Modes
        1. 7.4.2.1 Test Mode 0 - Fixed Pattern
        2. 7.4.2.2 Test Mode 1 - Horizontal Gradient
        3. 7.4.2.3 Test Mode 2 - Vertical Gradient
        4. 7.4.2.4 Test Mode 3 - Lattice Pattern
        5. 7.4.2.5 Test Mode 4 - Stripe Pattern
        6. 7.4.2.6 Test Mode 5 - LVDS Test Pattern (Synchronous)
        7. 7.4.2.7 Test Mode 6 - LVDS Test Pattern (Asynchronous)
        8. 7.4.2.8 Pseudo Random Number Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Writing to the Serial Registers
      3. 7.5.3 Reading the Serial Registers
      4. 7.5.4 Serial Interface Timing Details
    6. 7.6 Register Maps
      1. 7.6.1 Register Definitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Total Ionizing Dose
      2. 8.1.2 Single Event Latch-Up and Functional Interrupt
      3. 8.1.3 Single Event Effects
    2. 8.2 Typical Application
      1. 8.2.1 Sample/Hold Mode
    3. 8.3 Initialization Set Up
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power Planes
      2. 9.1.2 Bypass Capacitors
      3. 9.1.3 Ground Plane
      4. 9.1.4 Thermal Management
  10. 10器件和文档支持
    1. 10.1 器件支持
      1. 10.1.1 开发支持
        1. 10.1.1.1 评估板
        2. 10.1.1.2 寄存器编程软件
    2. 10.2 接收文档更新通知
    3. 10.3 社区资源
    4. 10.4 出口管制提示
    5. 10.5 商标
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11机械、封装和可订购信息
    1. 11.1 工程样片

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NBB|68
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1 Absolute Maximum Ratings(1)(2)

PARAMETER MIN MAX UNIT
Supply Voltage (VDD33) 4.2 V
Supply Voltage (VDD18) 2.35 V
Voltage on any VDD33 Input Pin
(Not to exceed 4.2 V)		 –0.3 VDD33 + 0.3 V
Voltage on any VDD33 Output Pin
(Not to exceed 4.2 V)		 –0.3 VDD33 + 0.3 V
Voltage on any VDD18 Input or Output Pin (33 to 52)
(Not to exceed 2.35 V)		 –0.3 VDD18 + 0.3 V
Input Current at any pin other than Supply Pins(3) ±25 mA
Package Input Current (except Supply Pins)(3) ±50 mA
Maximum Junction Temperature (TA) 150 °C
Storage Temperature –65 150 °C
(1) All voltages are measured with respect to VSS = 0 V, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Recommended Operating Conditions is not recommended
(3) When the input voltage (VIN) at any pin exceeds the power supplies (VIN < VSS or VIN > VDD33), the current at that pin should be limited to 25 mA. The 50-mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25 mA to two.