SNVS837B June   2013  – April 2016 LM3263

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation
      2. 7.3.2  PFM Operation
      3. 7.3.3  Active Current Assist and Analog Bypass (ACB)
      4. 7.3.4  Bypass Operation
      5. 7.3.5  Dynamic Adjustment of Output Voltage
      6. 7.3.6  DC-DC Operating Mode Selection
      7. 7.3.7  Internal Synchronous Rectification
      8. 7.3.8  Current Limit
      9. 7.3.9  Timed Current Limit
      10. 7.3.10 Thermal Overload Protection
      11. 7.3.11 Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Low-Power Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Active Mode
      5. 7.4.5 User States
    5. 7.5 Programming
      1. 7.5.1 RFFE Interface
      2. 7.5.2 Supported Command Sequences
      3. 7.5.3 Device Enumeration
      4. 7.5.4 GPO1
      5. 7.5.5 Trigger Registers
      6. 7.5.6 Control Interface Timing Parameters
    6. 7.6 Register Map
  8. Application Information
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Recommended External Components
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Capacitor Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout Considerations
    1. 10.1 Layout Guidelines
      1. 10.1.1 1. Overview
      2. 10.1.2 2. PCB
        1. 10.1.2.1 Energy Efficiency
        2. 10.1.2.2 EMI
      3. 10.1.3 3. Manufacturing Considerations
    2. 10.2 4. Layout Examples
      1. 10.2.1 DC-DC Converter
        1. 10.2.1.1 Star Connection Between VBATT, DC-DC Converter, and PA
          1. 10.2.1.1.1 VBATT Star Connection
    3. 10.3 DSBGA Package Assembly and Use
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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5 Pin Configuration and Functions

YFQ Package
16-Pin DSBGA
Top View
LM3263 top_pinconnect_snvs837.gif
YFQ Package
16-Pin DSBGA
Bottom View
LM3263 bottom_pinconnect_snvs837.gif

Pin Functions

PIN TYPE DESCRIPTION
NAME NUMBER
ACB A4 Output ACB and analog bypass output. Connect to the output at the output filter capacitor.
C4
BGND B3 Ground ACB, analog bypass ground, and digital ground.
FB C3 Input Feedback analog input. Connect to the output at the output filter capacitor.
GPO1 D2 Output General purpose output. Also used to reconfigure USID.
PACB B4 Power ACB power supply input
PGND A3 Ground Power ground to the internal NFET switch
PVIN A1 Power Power supply voltage input to the internal PFET switch
B1
SCLK D1 Digital/Input Digital control interface RFFE Bus clock input. Typically connected to RFFE master on RF or baseband IC. SCLK must be held low when VIO is not applied.
SDATA C2 Digital Input/Output Digital control interface RFFE bus data input/output. Typically connected to RFFE master on RF or baseband IC. SDATA must be held low when VIO is not applied.
SGND D3 Ground Signal analog ground (low current)
SVDD D4 Power Analog power supply voltage
SW A2 Analog Switching node connection to the internal PFET switch and NFET synchronous rectifier.
B2
VIO C1 Input VIO functions as the RFFE interface reference voltage. VIO also functions as reset and enable input to the LM3263. Typically connected to voltage regulator controlled by RF or baseband IC.