SNVS837B June   2013  – April 2016 LM3263

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation
      2. 7.3.2  PFM Operation
      3. 7.3.3  Active Current Assist and Analog Bypass (ACB)
      4. 7.3.4  Bypass Operation
      5. 7.3.5  Dynamic Adjustment of Output Voltage
      6. 7.3.6  DC-DC Operating Mode Selection
      7. 7.3.7  Internal Synchronous Rectification
      8. 7.3.8  Current Limit
      9. 7.3.9  Timed Current Limit
      10. 7.3.10 Thermal Overload Protection
      11. 7.3.11 Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Low-Power Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Active Mode
      5. 7.4.5 User States
    5. 7.5 Programming
      1. 7.5.1 RFFE Interface
      2. 7.5.2 Supported Command Sequences
      3. 7.5.3 Device Enumeration
      4. 7.5.4 GPO1
      5. 7.5.5 Trigger Registers
      6. 7.5.6 Control Interface Timing Parameters
    6. 7.6 Register Map
  8. Application Information
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Recommended External Components
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Capacitor Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout Considerations
    1. 10.1 Layout Guidelines
      1. 10.1.1 1. Overview
      2. 10.1.2 2. PCB
        1. 10.1.2.1 Energy Efficiency
        2. 10.1.2.2 EMI
      3. 10.1.3 3. Manufacturing Considerations
    2. 10.2 4. Layout Examples
      1. 10.2.1 DC-DC Converter
        1. 10.2.1.1 Star Connection Between VBATT, DC-DC Converter, and PA
          1. 10.2.1.1.1 VBATT Star Connection
    3. 10.3 DSBGA Package Assembly and Use
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.