SLUS696C June   2006  – February 2019

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Standard Serial Communication (SDQ) Timing
    7. 6.7 OTP Programming Specifications
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Non-Volatile Memory
      2. 7.3.2 Authentication
      3. 7.3.3 Communication and Power
    4. 7.4 Device Functional Modes
      1. 7.4.1 Profile Command
      2. 7.4.2 Sleep Mode Description
    5. 7.5 Programming
      1. 7.5.1 Communicating with the bq26100 Device
      2. 7.5.2 Memory Descriptions
        1. 7.5.2.1 Non-Volatile OTP Memory
          1. 7.5.2.1.1 General Use – Memory Function Commands 0xF0 (Read) and 0x0F (Write)
          2. 7.5.2.1.2 General Use — Memory Function Commands 0xFA (Read) and 0xAF (Write)
          3. 7.5.2.1.3 Status – Memory Function Commands 0xAA (Read) and 0x55 (Write)
            1. 7.5.2.1.3.1 PAGE LOCK (offset = D431h) [reset = 0h]
              1. Table 5. PAGE LOCK Field Descriptions
        2. 7.5.2.2 Non-Volatile EEPROM Memory
          1. 7.5.2.2.1 General Use – Memory Function Commands 0xE0 (Read) and 0x0E (Write)
      3. 7.5.3 SHA-1 Description
      4. 7.5.4 Key Programming Description
    6. 7.6 Register Maps
      1. 7.6.1 Volatile Register Memory
        1. 7.6.1.1 Message and Digest Registers – Memory Function Command 0xDD (Read) and 0x22 (Write)
        2. 7.6.1.2 Control and Version Registers – Memory Function Command 0x88 (Read) and 0x77 (Write)
          1. 7.6.1.2.1 CTRL Register (address = 0001h) [reset = 1h]
            1. Table 9. Control Register Field Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Standard Serial Communication (SDQ) Timing

over recommended operating temperature and supply voltage range (unless otherwise noted) (See Figure 1)
MIN NOM MAX UNIT
tRSTL Reset time – low 480 μs
tRSTH Reset time – high 480 μs
tPDL Presence detect – low 60 240 μs
tPDH Presence detect – high 15 60 μs
tREC Recovery time 1 μs
tSLOT Host bit window 60 120 μs
tLOW1 Host sends 1 1 13 μs
tLOW0 Host sends 0 60 120 μs
tLOWR Host read bit start 1 13 μs
tSLOT bq26100 bit window 60 120 μs
tSU bq26100 data setup 1 μs
tRDV bq26100 data valid exactly 15 μs
tRELEASE bq26100 data release 0 15 45 μs