产品详情

CPU Arm Cortex-R4F Frequency (MHz) 180 Flash memory (kByte) 3072 RAM (kByte) 256 ADC type 2 12-bit SAR Features CAN, Ethernet, FlexRay, Hercules high-performance microcontroller, SPI, UART UART 2 CAN (#) 3 PWM (Ch) 44 Number of ADC channels 24 SPI 2 Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product Communication interface CAN, Ethernet, FlexRay, SPI, UART Operating system AutoSAR, FreeRTOS, SafeRTOS Hardware accelerators Floating point unit Edge AI enabled No Nonvolatile memory (kByte) 3072 Number of GPIOs 144
CPU Arm Cortex-R4F Frequency (MHz) 180 Flash memory (kByte) 3072 RAM (kByte) 256 ADC type 2 12-bit SAR Features CAN, Ethernet, FlexRay, Hercules high-performance microcontroller, SPI, UART UART 2 CAN (#) 3 PWM (Ch) 44 Number of ADC channels 24 SPI 2 Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product Communication interface CAN, Ethernet, FlexRay, SPI, UART Operating system AutoSAR, FreeRTOS, SafeRTOS Hardware accelerators Floating point unit Edge AI enabled No Nonvolatile memory (kByte) 3072 Number of GPIOs 144
NFBGA (GWT) 337 256 mm² (16 mm × 16 mm)
  • High-Performance Microcontroller for Safety-
    Critical Applications
    • Dual CPUs Running in Lockstep
    • ECC on Flash and RAM interfaces
    • Built-In Self-Test for CPU and On-chip RAMs
    • Error Signaling Module with Error Pin
    • Voltage and Clock Monitoring
  • ARM® Cortex – R4F 32-Bit RISC CPU
    • Efficient 1.66 DMIPS/MHz with 8-Stage Pipeline
    • FPU with Single- and Double-Precision
    • 12-Region Memory Protection Unit
    • Open Architecture with Third-Party Support
  • Operating Conditions
    • Up to 180-MHz System Clock
    • Core Supply Voltage (VCC): 1.2 V Nominal
    • I/O Supply Voltage (VCCIO): 3.3 V Nominal
    • ADC Supply Voltage (VCCAD): 3.0 to 5.25 V
    • IP Modules GBD for –40°C to 125°C Only
      includes Flash, MibADC timings, nPORRST,
      N2HET, and FlexRay
  • Integrated Memory
    • 3MB of Program Flash With ECC
    • 256KB of RAM With ECC
    • 64KB of Flash With ECC for Emulated
      EEPROM
  • 16-Bit External Memory Interface
  • Common Platform Architecture
    • Consistent Memory Map Across Family
    • Real-Time Interrupt Timer (RTI) OS Timer
    • 96-Channel Vectored Interrupt Module (VIM)
    • 2-Channel Cyclic Redundancy Checker (CRC)
  • Direct Memory Access (DMA) Controller
    • 16 Channels and 32 Control Packets
    • Parity Protection for Control Packet RAM
    • DMA Accesses Protected by Dedicated MPU
  • Frequency-Modulated Phase-Locked-Loop
    (FMPLL) with Built-In Slip Detector
  • Separate Nonmodulating PLL
  • IEEE 1149.1 JTAG, Boundary Scan and ARM
    CoreSight™ Components
  • JTAG Security Module
  • Trace and Calibration Capabilities
    • Embedded Trace Macrocell (ETM-R4)
    • Data Modification Module (DMM)
    • RAM Trace Port (RTP)
    • Parameter Overlay Module (POM)
  • Multiple Communication Interfaces
    • 10/100 Mbps Ethernet MAC (EMAC)
      • IEEE 802.3 Compliant (3.3-V I/O only)
      • Supports MII, RMII and MDIO
    • FlexRay Controller with Two Channels
      • 8 KB message RAM with Parity Protection
      • Dedicated Transfer Unit (FTU)
    • Three CAN Controllers (DCANs)
      • 64 Mailboxes, Each with Parity Protection
      • Compliant to CAN Protocol Version 2.0B
    • Local Interconnect Network (LIN) Interface
      Controller
      • Compliant to LIN Protocol Version 2.1
      • Can be Configured as a Second SCI
    • Standard Serial Communication Interface (SCI)
    • Inter-Integrated Circuit (I2C)
    • Three Multibuffered Serial Peripheral Interfaces
      (MibSPIs)
      • 128 Words with Parity Protection Each
    • Two Standard Serial Peripheral Interfaces
      (SPIs)
  • Two High-End Timer Modules (N2HETs)
    • N2HET1: 32 Programmable Channels
    • N2HET2: 18 Programmable Channels
    • 160-Word Instruction RAM with Parity Protection
      Each
    • Each N2HET Includes Hardware Angle
      Generator
    • Dedicated Transfer Unit with MPU for Each
      N2HET (HTU)
  • Two 10- or 12-bit Multibuffered ADC Modules
    • ADC1: 24 Channels
    • ADC2: 16 Channels Shared with ADC1
    • 64 Result Buffers with Parity Protection Each
  • Sixteen General-Purpose Input/Output Pins (GPIO)
    Capable of Generating Interrupts
  • Package
    • 337-Ball Grid Array (SnPb) (GWT)
  • High-Performance Microcontroller for Safety-
    Critical Applications
    • Dual CPUs Running in Lockstep
    • ECC on Flash and RAM interfaces
    • Built-In Self-Test for CPU and On-chip RAMs
    • Error Signaling Module with Error Pin
    • Voltage and Clock Monitoring
  • ARM® Cortex – R4F 32-Bit RISC CPU
    • Efficient 1.66 DMIPS/MHz with 8-Stage Pipeline
    • FPU with Single- and Double-Precision
    • 12-Region Memory Protection Unit
    • Open Architecture with Third-Party Support
  • Operating Conditions
    • Up to 180-MHz System Clock
    • Core Supply Voltage (VCC): 1.2 V Nominal
    • I/O Supply Voltage (VCCIO): 3.3 V Nominal
    • ADC Supply Voltage (VCCAD): 3.0 to 5.25 V
    • IP Modules GBD for –40°C to 125°C Only
      includes Flash, MibADC timings, nPORRST,
      N2HET, and FlexRay
  • Integrated Memory
    • 3MB of Program Flash With ECC
    • 256KB of RAM With ECC
    • 64KB of Flash With ECC for Emulated
      EEPROM
  • 16-Bit External Memory Interface
  • Common Platform Architecture
    • Consistent Memory Map Across Family
    • Real-Time Interrupt Timer (RTI) OS Timer
    • 96-Channel Vectored Interrupt Module (VIM)
    • 2-Channel Cyclic Redundancy Checker (CRC)
  • Direct Memory Access (DMA) Controller
    • 16 Channels and 32 Control Packets
    • Parity Protection for Control Packet RAM
    • DMA Accesses Protected by Dedicated MPU
  • Frequency-Modulated Phase-Locked-Loop
    (FMPLL) with Built-In Slip Detector
  • Separate Nonmodulating PLL
  • IEEE 1149.1 JTAG, Boundary Scan and ARM
    CoreSight™ Components
  • JTAG Security Module
  • Trace and Calibration Capabilities
    • Embedded Trace Macrocell (ETM-R4)
    • Data Modification Module (DMM)
    • RAM Trace Port (RTP)
    • Parameter Overlay Module (POM)
  • Multiple Communication Interfaces
    • 10/100 Mbps Ethernet MAC (EMAC)
      • IEEE 802.3 Compliant (3.3-V I/O only)
      • Supports MII, RMII and MDIO
    • FlexRay Controller with Two Channels
      • 8 KB message RAM with Parity Protection
      • Dedicated Transfer Unit (FTU)
    • Three CAN Controllers (DCANs)
      • 64 Mailboxes, Each with Parity Protection
      • Compliant to CAN Protocol Version 2.0B
    • Local Interconnect Network (LIN) Interface
      Controller
      • Compliant to LIN Protocol Version 2.1
      • Can be Configured as a Second SCI
    • Standard Serial Communication Interface (SCI)
    • Inter-Integrated Circuit (I2C)
    • Three Multibuffered Serial Peripheral Interfaces
      (MibSPIs)
      • 128 Words with Parity Protection Each
    • Two Standard Serial Peripheral Interfaces
      (SPIs)
  • Two High-End Timer Modules (N2HETs)
    • N2HET1: 32 Programmable Channels
    • N2HET2: 18 Programmable Channels
    • 160-Word Instruction RAM with Parity Protection
      Each
    • Each N2HET Includes Hardware Angle
      Generator
    • Dedicated Transfer Unit with MPU for Each
      N2HET (HTU)
  • Two 10- or 12-bit Multibuffered ADC Modules
    • ADC1: 24 Channels
    • ADC2: 16 Channels Shared with ADC1
    • 64 Result Buffers with Parity Protection Each
  • Sixteen General-Purpose Input/Output Pins (GPIO)
    Capable of Generating Interrupts
  • Package
    • 337-Ball Grid Array (SnPb) (GWT)

The TMS570LS3137-EP device is a high-performance microcontroller family for safety systems. The safety architecture includes the following:

  • Dual CPUs in lockstep
  • CPU and memory built-in self-test (BIST) logic
  • ECC on both the flash and the data SRAM
  • Parity on peripheral memories
  • Loopback capability on peripheral I/Os

The TMS570LS3137-EP device integrates the ARM Cortex-R4F Floating-Point CPU which offers an efficient 1.66 DMIPS/MHz, and has configurations which can run up to 180 MHz, providing up to 298 DMIPS. The device supports the word-invariant big-endian [BE32] format.

The TMS570LS3137-EP device has 3MB of integrated flash and 256KB of data RAM with single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (same level as I/O supply) for all read, program and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 180 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word and double-word modes.

The TMS570LS3137-EP device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors and two 12-bit analog-to-digital converters (ADCs) supporting up to 24 inputs.

The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.

The device has two 12-bit-resolution MibADCs with 24 channels and 64 words of parity-protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Sixteen channels are shared between the two MibADCs. There are three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode.

The device has multiple communication interfaces: three MibSPIs, , one LIN, one SCI, three DCANs, one I2C. The SPIs provide a convenient method of serial high-speed communication between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format.

The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for systems operating in noisy and harsh environments (for example, automotive vehicle networking and industrial fieldbus) that require reliable serial communication or multiplexed wiring.

The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device via the I2C serial bus. The I2C supports speeds of 100 and 400 Kbps.

The frequency-modulated phase-locked loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. There are two FMPLL modules on this device. These modules, when enabled, provide two of the seven possible clock source inputs to the global clock module (GCM). The GCM manages the mapping between the available clock sources and the device clock domains.

The device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin/ball. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.

The DMA controller has 16 channels, 32 control packets and parity protection on its memory. An MPU is built into the DMA to limit the DMA to prescribed areas of memory and to protect the rest of the memory system from any malfunction of the DMA.

The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is generated or the external ERROR pin is toggled when a fault is detected. The ERROR pin can be monitored externally as an indicator of a fault condition in the microcontroller.

The External Memory Interface (EMIF) provides off-chip expansion capability with the ability to interface to synchronous DRAM (SDRAM) devices, asynchronous memories, peripherals or FPGA devices.

Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built in ARM Cortex-R4F CoreSight debug features an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can reroute flash accesses to internal memory or to the EMIF. This rerouting allows parameters and tables to be dynamically calibrated against production code without rebuilding the code to explicitly access RAM or halting the processor to reprogram the data flash.

With integrated safety features and a wide choice of communication and control peripherals, the device is an ideal solution for high-performance real-time control applications with safety-critical requirements.

The TMS570LS3137-EP device is a high-performance microcontroller family for safety systems. The safety architecture includes the following:

  • Dual CPUs in lockstep
  • CPU and memory built-in self-test (BIST) logic
  • ECC on both the flash and the data SRAM
  • Parity on peripheral memories
  • Loopback capability on peripheral I/Os

The TMS570LS3137-EP device integrates the ARM Cortex-R4F Floating-Point CPU which offers an efficient 1.66 DMIPS/MHz, and has configurations which can run up to 180 MHz, providing up to 298 DMIPS. The device supports the word-invariant big-endian [BE32] format.

The TMS570LS3137-EP device has 3MB of integrated flash and 256KB of data RAM with single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (same level as I/O supply) for all read, program and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 180 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word and double-word modes.

The TMS570LS3137-EP device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors and two 12-bit analog-to-digital converters (ADCs) supporting up to 24 inputs.

The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.

The device has two 12-bit-resolution MibADCs with 24 channels and 64 words of parity-protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Sixteen channels are shared between the two MibADCs. There are three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode.

The device has multiple communication interfaces: three MibSPIs, , one LIN, one SCI, three DCANs, one I2C. The SPIs provide a convenient method of serial high-speed communication between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format.

The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for systems operating in noisy and harsh environments (for example, automotive vehicle networking and industrial fieldbus) that require reliable serial communication or multiplexed wiring.

The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device via the I2C serial bus. The I2C supports speeds of 100 and 400 Kbps.

The frequency-modulated phase-locked loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. There are two FMPLL modules on this device. These modules, when enabled, provide two of the seven possible clock source inputs to the global clock module (GCM). The GCM manages the mapping between the available clock sources and the device clock domains.

The device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin/ball. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.

The DMA controller has 16 channels, 32 control packets and parity protection on its memory. An MPU is built into the DMA to limit the DMA to prescribed areas of memory and to protect the rest of the memory system from any malfunction of the DMA.

The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is generated or the external ERROR pin is toggled when a fault is detected. The ERROR pin can be monitored externally as an indicator of a fault condition in the microcontroller.

The External Memory Interface (EMIF) provides off-chip expansion capability with the ability to interface to synchronous DRAM (SDRAM) devices, asynchronous memories, peripherals or FPGA devices.

Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built in ARM Cortex-R4F CoreSight debug features an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can reroute flash accesses to internal memory or to the EMIF. This rerouting allows parameters and tables to be dynamically calibrated against production code without rebuilding the code to explicitly access RAM or halting the processor to reprogram the data flash.

With integrated safety features and a wide choice of communication and control peripherals, the device is an ideal solution for high-performance real-time control applications with safety-critical requirements.

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 TMS570LS3137-EP 16- and 32-Bit RISC Flash Microcontroller 数据表 (Rev. D) PDF | HTML 2015-2-20
* 用户指南 TMS570LS31x/21x 16/32-Bit RISC Flash Microcontroller Technical Reference Manual (Rev. C) 2018-3-1
* 勘误表 TMS570LS31x/21x Microcontroller Silicon Errata (Silicon Revision D) (Rev. B) 2016-5-31
* 勘误表 TMS570LS31x/21x Microcontroller Silicon Errata (Silicon Revision C) (Rev. G) 2016-5-31
* 辐射与可靠性报告 TMS5703137CGWTMEP Reliability Report 2015-2-6
* 辐射与可靠性报告 TMS5703137CGWTQEP Reliability Report 2014-12-22
* VID TMS570LS3137-EP VID V6213629 2016-6-21
选择指南 增强型产品选择指南 (Rev. C) PDF | HTML 英语版 (Rev.C) PDF | HTML 2021-8-5
更多文献资料 Hercules™ Diagnostic Library Test Automation Unit User Guide (Rev. B) PDF | HTML 2020-1-9
功能安全信息 HALCoGen-CSP Installation Guide (Rev. B) PDF | HTML 2020-1-8
功能安全信息 HALCoGen-CSP User's Guide (Rev. C) PDF | HTML 2020-1-8
功能安全信息 Hercules Diagnostic Library -TAU Installation Guide (Rev. B) PDF | HTML 2020-1-8
更多文献资料 HALCoGen-CSP 04.07.01 (Rev. C) PDF | HTML 2020-1-8
用户指南 Hercules Diagnostic Library CSP Without LDRA 2019-10-29
应用手册 HALCoGen Ethernet Driver With lwIP Integration Demo and Active Webserver Demo PDF | HTML 2019-9-13
应用手册 CAN Bus Bootloader for Hercules Microcontrollers PDF | HTML 2019-8-21
应用手册 HALCoGen CSP Without LDRA Release_Notes 2019-8-19
用户指南 HALCoGen-CSP Without LDRA Installation Guide PDF | HTML 2019-8-19
用户指南 HALCoGen-CSP Without LDRA User's Guide PDF | HTML 2019-8-19
用户指南 Hercules™ Diag Lib Test Automation Unit Without LDRA User's Guide PDF | HTML 2019-8-19
用户指南 Hercules Diagnostic Library - Without LDRA Installation Guide PDF | HTML 2019-8-19
应用手册 Sharing FEE Blocks Between the Bootloader and the Application 2017-11-7
应用手册 Sharing Exception Vectors on Hercules™ Based Microcontrollers 2017-3-27
应用手册 How to Create a HALCoGen Based Project For CCS (Rev. B) 2016-8-9
应用手册 Using the CRC Module on Hercules™-Based Microcontrollers 2016-8-4
应用手册 Using the SPI as an Extra UART Transmitter 2016-7-26
应用手册 High Speed Serial Bus Using the MibSPIP Module on Hercules-Based MCUs 2016-4-22
应用手册 Triggering ADC Using Internal Timer Events on Hercules MCUs 2015-10-19
应用手册 Continuous Monitor of the PLL Frequency With the DCC 2015-7-24
功能安全信息 Foundational Software for Functional Safety 2015-5-12
应用手册 Sine Wave Generation Using PWM With Hercules N2HET and HTU 2015-5-12
应用手册 Triangle/Trapezoid Wave Generation Using PWM With Hercules N2HET 2015-5-1
应用手册 Hercules SCI With DMA 2015-3-22

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调试探针

LB-3P-TRACE32-ARM — 适用于基于 Arm® 的微控制器和处理器的 Lauterbach TRACE32® 调试和跟踪系统

Lauterbach TRACE32® 工具是一套先进的硬件和软件组件,开发人员可通过它分析、优化和认证各种基于 Arm® 的微控制器和处理器。这套全球知名的嵌入式系统和 SoC 调试和跟踪解决方案是所有开发阶段(从器件前开发一直到产品认证和现场故障排查)的理想解决方案。Lauterbach 工具直观的模块化设计可为工程师提供当今最高的可用性能,并提供可随需求变化而调整和扩展的系统。借助 TRACE32® 调试器,开发人员还可以通过单个调试接口同时调试和控制 SoC 中的任何 C28x/C29x C6x/C7x DSP 内核以及所有其他 Arm 内核,这是业界的一项独特功能。

来源:Lauterbach GmbH
支持的产品和硬件
硬件编程工具

ALGO-3P-WRITENOW — Algocraft WriteNow! 编程器

WriteNow! 系列系统内编程器是编程行业的突破性产品。该系列编程器支持来自不同制造商的众多器件(微控制器、存储器、CPLD 和其他可编程器件),并具有紧凑的尺寸,方便与 ATE/固定装置集成。它们可独立运行,也可连接到主机 PC(内置 RS-232、LAN 和 USB 连接),并附带易于使用的软件实用程序。

来源:Algocraft
支持的产品和硬件
IDE、配置、编译器或调试器

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

支持的产品和硬件
支持软件

VCTR-3P-MICROSAR — 适用于微控制器和高性能计算机 (HPC) 的 Vector MICROSAR AUTOSAR 软件

MICROSAR 和 DaVinci 产品系列凭借适用于微控制器和 HPC 的先进嵌入式软件和强大的开发工具简化了 ECU 开发。利用先进的基础设施软件,即可为 ECU 奠定良好基础,并使用相关工具简化所有配套开发任务。MICROSAR 嵌入式软件是按照 AUTOSAR classic 和 adaptive 等相关标准开发的。根据 ISO 26262 高达 ASIL D 的安全标准,该软件还适用于安全相关应用。此外,智能网络安全功能可保护控制单元免受未经授权的访问和操纵。Vector 涵盖汽车和其他工业应用的所有用例。对于具有高性能计算机的软件定义车辆 (...)

支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
NFBGA (GWT) 337 Ultra Librarian

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