TMP9R01-SEP
- QMLP, Radiation Hardness Assured (RHA)
- SMD 5962-17218:
- TID characterized up to 100krad(Si)
- TID RLAT/RHA to 100krad(Si)
- SEL immune to LET= 75MeV×cm2/mg at 125°C
- SEE characterized to LET= 75MeV×cm2/mg
- SEFI characterized to LET= 75MeV×cm2/mg
- QMLV version available: TMP461-SP
- Radiation Tolerant (Space Enhanced Plastic)
- Vendor item drawing (VID) V62/24615
- TID characterized up to 50krad(Si)
- TID RLAT/RHA to 30krad(Si)
- SEL immune to LET= 43MeV×cm2/mg at 125°C
- SEE characterized to LET= 43MeV×cm2/mg
- SEFI characterized to LET= 43MeV×cm2/mg
- Temperature accuracy and range:
- 12-bit resolution: 0.0625°C (LSB)
- Local (on-chip) temp accuracy: ±2.0°C (Max)
- Remote junction temp accuracy: ±1.5°C (Max)
- Remote range tested to: –64°C to 191°C
-
Military temperature range: -55 to 125°C
- Small-size package: VSSOP-10, 4.9mm × 3.0mm
- Integrated calibration/ protection features:
- η-factor and offset correction
- Series resistance cancellation
- Remote BJT/diode fault detection
- Programmable digital filter
- Wide operating range, low power:
- Voltage supply range: 1.7V to 3.6V
- I/O voltages: 1.8V, 2.5V, and 3.3V
- Standby/shutdown IQ: 15µA/3µA
- TMP9R01 Example Driver
The TMP9R01-SP (QML Class P) and TMP9R01-SEP (Radiation Tolerant, Space EP) are high-accuracy digital I2C space-grade temperature sensors integrating a 12-bit ADC, bias current sources, and calibration circuitry in a 10-pin VSSOP plastic package. The devices measure remote temperature by forcing a bias current through an external BJT or the integrated diode/junction of an FPGA, ADC, or ASIC, digitizing the resulting ΔVBE and reporting temperature with 0.0625°C resolution. An additional sensor provides on-chip temperature.
The TMP9R01-SP and TMP9R01-SEP incorporate multiple calibration and protection features, including series-resistance cancellation, programmable non-ideality factor (η-Factor), offset correction, and programmable digital filter. Designers can set high- and low-temperature limits that drive the ALERT output for over-and-under temperature thermal protection. Up to 9 pin-selectable I2C/SMBus addresses allow multiple sensors on the same I2C bus. The devices are designed for multi-location spacecraft housekeeping, satellite telemetry, avionics, and other high-reliability applications that require precise, temperature sensing and with varying levels of radiation hardness.
The TMP9R01-SP is also available as a functionally equivalent QMLV-RHA device: TMP461-SP.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TMP9R01-SP (QMLP RHA) and TMP9R01-SEP (Radiation Tolerant) Space-Grade, I2 C Digital Temperature Sensor With Remote and Local (On-Chip) Temperature Sensing 数据表 (Rev. B) | PDF | HTML | 2026-10-15 | ||
| * | 辐射与可靠性报告 | TMP9R01-SEP Production Flow and Reliability Report (Rev. A) | PDF | HTML | 2025-7-31 | ||
| * | 辐射与可靠性报告 | TMP9R01-SEP Total Ionizing Dose (TID) Report (Rev. C) | 2025-6-27 | |||
| * | 辐射与可靠性报告 | TMP9R01-SEP Single-Event Effects (SEE) Radiation Test Report (Rev. B) | PDF | HTML | 2025-6-19 | ||
| 选择指南 | TI Space Products (Rev. L) | 2026-3-27 | ||||
| 应用手册 | 如何优化航天级温度检测设计 | PDF | HTML | 英语版 | PDF | HTML | 2025-11-17 | |
| 产品概述 | TI 航天级温度传感器产品选型指南 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2025-1-29 | |
| 应用手册 | Remote Temperature Transistor Sensor Selection Guide | PDF | HTML | 2021-3-24 |
设计与开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
TMP9R01EVM — TMP9R01 评估模块
ALPHA-3P-ADM-VA601-SPACE-AMD — 采用 AMD Versal Core XQRVC1902 ACAP 和 TI 抗辐射产品的 Alpha Data ADM-VA601 套件
具有 6U VPX 外形,突出了 AMD-Xilinx® Versal AI Core XQRVC1902 自适应 SoC/FPGA。ADM-VA600 采用模块化板设计,带有一个 FMC+ 连接器、DDR4 DRAM 和系统监控功能。大多数元件是耐辐射电源管理、接口、时钟和嵌入式处理 (-SEP) 器件。
ALPHA-3P-VB630-SPACE-AMD — 采用 AMD Versal edge XQRVE2302 ACAP 和 TI 抗辐射产品的 Alpha Data ADM-VB630 套件
具有 3U VPX 外形,突出了 AMD-Xilinx® Versal AI Edge XQRVE2302 自适应 SoC/FPGA。ADM-VB630 是单板计算机电路板。大多数元件是耐辐射电源管理、接口和感测 (-SEP) 产品组合。
TIDA-011004 — 航天级 3U VPX 电源模块参考设计
此参考设计是一款符合 VITA-62 标准的航天级电源模块,适用于航天级 3U VPX 架构。Space VPX 标准通过为模块化和可扩展系统定义框架来实现标准化和互操作性,这些系统可用于各种不同的任务配置文件。此参考设计采用紧凑的外形尺寸实现,同时保持了极高的整体性能。
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| VSSOP (DGS) | 10 | Ultra Librarian |