홈 전력 관리 DC/DC 전력 모듈 벅 모듈(통합 인덕터)
홈
전력 관리
DC/DC 전력 모듈
벅 모듈(통합 인덕터)
신규

TPSM8287B15

활성

6V, 15A parallelable DC/DC buck module with I2C, frequency synchronization and MagPack technology

지금 주문
데이터 시트

TPSM8287B15

활성
데이터 시트 지금 주문

제품 상세 정보

Rating Catalog Topology Buck, Step-Down Converter, Synchronous Buck Iout (max) (A) 15 Vin (max) (V) 6 Vin (min) (V) 2.7 Vout (max) (V) 1.675 Vout (min) (V) 0.4 Features Adjustable soft start, Current Sharing, Differential Remote Sense, Differential Voltage sensing, EMI Tested, Enable, Frequency Dithering, Frequency synchronization, I2C control, I2C interface, I2C support, I2C/PMBus, Light Load Efficiency, MagPack technology, Multiphase, Output discharge, Overcurrent protection, Phase Interleaving, Power good, Remote Sense, Remote Sensing, Soft Start Adjustable, Soft-start adjustable, Spread-spectrum frequency dithering EMI features Low parasitic Hotrod packaging, Spread Spectrum Operating temperature range (°C) -40 to 125 Type Module Duty cycle (max) (%) 75 Control mode COT, Constant on-time (COT), DCS-Control Switching frequency (min) (kHz) 1200 Switching frequency (max) (kHz) 1800
Rating Catalog Topology Buck, Step-Down Converter, Synchronous Buck Iout (max) (A) 15 Vin (max) (V) 6 Vin (min) (V) 2.7 Vout (max) (V) 1.675 Vout (min) (V) 0.4 Features Adjustable soft start, Current Sharing, Differential Remote Sense, Differential Voltage sensing, EMI Tested, Enable, Frequency Dithering, Frequency synchronization, I2C control, I2C interface, I2C support, I2C/PMBus, Light Load Efficiency, MagPack technology, Multiphase, Output discharge, Overcurrent protection, Phase Interleaving, Power good, Remote Sense, Remote Sensing, Soft Start Adjustable, Soft-start adjustable, Spread-spectrum frequency dithering EMI features Low parasitic Hotrod packaging, Spread Spectrum Operating temperature range (°C) -40 to 125 Type Module Duty cycle (max) (%) 75 Control mode COT, Constant on-time (COT), DCS-Control Switching frequency (min) (kHz) 1200 Switching frequency (max) (kHz) 1800
QFN-FCMOD (VCH) 37 30 mm² 8 x 3.75
  • ±0.8% output voltage accuracy
  • Differential remote sensing
  • Parallelable for multiphase operation
  • Start-up output voltage and I2C addresses selectable through VSETx pins:
    • 0.4V to 0.775V in 25mV steps
    • 0.8V to 1.55V in 50mV steps
  • Output voltage I2C adjustable in 1.25mV steps
  • Adjustable external compensation for wide output capacitor range and optimized transient response
  • Designed for low EMI requirements
    • MagPack technology shields inductor and IC
    • No bond wire package
    • Optional internal input and output capacitors
    • Simplified layout through parallel input path
    • Optional synchronization to external clock or spread-spectrum operation

  • Optional droop compensation through I2C

  • Power save mode or forced PWM operation
  • Precise enable input threshold
  • Power-good output with window comparator
  • Active output discharge
  • Excellent thermal performance
  • –40°C to 125°C operating temperature range
  • 3.75mm × 8.0mm QFN package with 0.5mm pitch
  • 66mm2 design size
  • ±0.8% output voltage accuracy
  • Differential remote sensing
  • Parallelable for multiphase operation
  • Start-up output voltage and I2C addresses selectable through VSETx pins:
    • 0.4V to 0.775V in 25mV steps
    • 0.8V to 1.55V in 50mV steps
  • Output voltage I2C adjustable in 1.25mV steps
  • Adjustable external compensation for wide output capacitor range and optimized transient response
  • Designed for low EMI requirements
    • MagPack technology shields inductor and IC
    • No bond wire package
    • Optional internal input and output capacitors
    • Simplified layout through parallel input path
    • Optional synchronization to external clock or spread-spectrum operation

  • Optional droop compensation through I2C

  • Power save mode or forced PWM operation
  • Precise enable input threshold
  • Power-good output with window comparator
  • Active output discharge
  • Excellent thermal performance
  • –40°C to 125°C operating temperature range
  • 3.75mm × 8.0mm QFN package with 0.5mm pitch
  • 66mm2 design size

The TPSM8287Bxx is a family of pin-to-pin, step-down, DC/DC power modules with differential remote sensing and I2C interface. The power modules use TI’s MagPack technology to integrate a synchronous step-down converter, an inductor, input and output capacitors to simplify design, reduce external components and save PCB area. The low-profile and compact design is designed for assembly by standard surface mount equipment. The TPSM8287Bxx family implements an enhanced control scheme that supports fast transients. The TPSM8287Bxx can operate in fixed-frequency or power save mode. The remote sensing feature optimizes voltage regulation at the point-of-load and the device achieves ±0.8% DC voltage accuracy over the entire temperature range. The devices can operate in stacked, paralleled mode to deliver higher output currents or to spread the power dissipation across multiple devices. The I2C-compatible interface offers several control, monitoring, and warning features. The start-up voltage is selectable through the VSETx pins to allow a power-up without an active I2C communication.

The TPSM8287Bxx is a family of pin-to-pin, step-down, DC/DC power modules with differential remote sensing and I2C interface. The power modules use TI’s MagPack technology to integrate a synchronous step-down converter, an inductor, input and output capacitors to simplify design, reduce external components and save PCB area. The low-profile and compact design is designed for assembly by standard surface mount equipment. The TPSM8287Bxx family implements an enhanced control scheme that supports fast transients. The TPSM8287Bxx can operate in fixed-frequency or power save mode. The remote sensing feature optimizes voltage regulation at the point-of-load and the device achieves ±0.8% DC voltage accuracy over the entire temperature range. The devices can operate in stacked, paralleled mode to deliver higher output currents or to spread the power dissipation across multiple devices. The I2C-compatible interface offers several control, monitoring, and warning features. The start-up voltage is selectable through the VSETx pins to allow a power-up without an active I2C communication.
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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
16개 모두 보기
유형 직함 날짜
* Data sheet TPSM8287Bxx 2.7V to 6V Input, 15A, 20A, 25A, and 30A, Parallelable, Step-Down Power Module With I2 C Interface and Remote Sense in a MagPack Package datasheet (Rev. A) PDF | HTML 2025/12/10
Application brief Increasing Further Data Rates Using High-Current Power Converters in Optical Modules PDF | HTML 2024/09/26
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 2023/12/06
Application note Benefiting from Step-Down Converters with an I2C Communication Interface (Rev. B) PDF | HTML 2023/11/29
Application note Adjusting the Output Voltage of a Fixed Output Voltage DC-DC Converter PDF | HTML 2022/12/22
Application note Intro to Multi-Function Pins and Their Applications in TI Step-Down Converters (Rev. A) PDF | HTML 2022/11/17
Application note Understanding SOA Curves to Operate at High Output Currents and Temperature PDF | HTML 2022/05/05
Application note How to Measure Impedance of a Power Distribution Network of a DC-DC Converter PDF | HTML 2022/01/20
Application note Loop Gain Reconstruction of a Step-Down Converter from Output Impedance PDF | HTML 2022/01/20
White paper Enabling Higher Data Rates for Optical Modules With Small and Efficient Power 2021/03/22
White paper Benefits of a Resistor-to-Digital Converter in Ultra-Low Power Supplies 2019/10/14
Analog Design Journal Methods of output-voltage adjustment for DC/DC converters 2019/06/14
Analog Design Journal Achieving a clean startup by using a DC/DC converter with a precise enable-pin threshold 2017/10/24
Application note Basic Calculation of a Buck Converter's Power Stage (Rev. B) 2015/08/17
Analog Design Journal High-efficiency, low-ripple DCS-Control offers seamless PWM/pwr-save transitions 2013/07/25
Application note Choosing an Appropriate Pull-up/Pull-down Resistor for Open Drain Outputs 2011/09/19

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TPSM8287B30LAPEVM — TPSM8287B30 평가 모듈

TPSM8287B30 EVM(평가 모듈)을 통해 TPSM8287B30을 쉽게 평가할 수 있습니다. 이 장치는 핀 대 핀 호환, 스텝다운 전원 모듈에서 최대 30A의 부하 전류를 지원하며, 3.75mm × 8mm MagPack™ 패키지에 I2C 인터페이스, 원격 감지 및 주파수 동기화 기능을 갖추고 있습니다. EVM은 2.7V~6V의 입력 전압에서 0.4V~1.675V 사이의 0.8%의 정확도를 가진 I2C 조정 가능 출력 전압을 제공합니다.
사용 설명서: PDF | HTML
TI.com에서 구매 불가
평가 모듈(EVM)용 GUI

TPSM8287B-EVM-GUI — TPSM8287B EVM GUI

The TPSM8287B EVM GUI interfaces with the TPSM8287Bxx EVMs via the USB2ANY adaptor to read and write to the device's I2C registers.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
벅 모듈(통합 인덕터)
TPSM8287B15 — 6V, 15A parallelable DC/DC buck module with I2C, frequency synchronization and MagPack technology TPSM8287B30 — 6V, 30A parallelable DC/DC buck module with I2C, frequency synchronization and MagPack technology
하드웨어 개발
평가 보드
TPSM8287B30LAPEVM — TPSM8287B30 평가 모듈 TPSM8287B30-2X-EVM — TPSM8287B30-2x-EVM 평가 모듈
시작 다운로드
계산 툴

TPSM8287B-CALC — TPSM8287B component calculator

TPSM8287B component calculator
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
벅 모듈(통합 인덕터)
TPSM8287B15 — 6V, 15A parallelable DC/DC buck module with I2C, frequency synchronization and MagPack technology TPSM8287B30 — 6V, 30A parallelable DC/DC buck module with I2C, frequency synchronization and MagPack technology
다운로드
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
QFN-FCMOD (VCH) 37 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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