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TS3USB30E 正在供货 具有单独使能和 ESD 保护的高速 USB 2.0 1:2 多路复用/多路解复用开关 Improved ESD protection

产品详情

Protocols USB 2.0 Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 955 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Supply current (typ) (µA) 1 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -56 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 64 COFF (typ) (pF) 2 CON (typ) (pF) 7 Off isolation (typ) (dB) -39 OFF-state leakage current (max) (µA) 2 Propagation delay time (µs) 0.00025 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 RON flatness (typ) (Ω) 2 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 1.3 VIL (max) (V) 0.7
Protocols USB 2.0 Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 955 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Supply current (typ) (µA) 1 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -56 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 64 COFF (typ) (pF) 2 CON (typ) (pF) 7 Off isolation (typ) (dB) -39 OFF-state leakage current (max) (µA) 2 Propagation delay time (µs) 0.00025 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 RON flatness (typ) (Ω) 2 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 1.3 VIL (max) (V) 0.7
UQFN (RSW) 10 2.52 mm² 1.8 x 1.4
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down-Mode
    Operation
  • Ron = 10 Ω Maximum
  • ΔRon <0.35 Ω Typical
  • Cio(ON) = 7 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human Body Model (HBM)
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • –3-dB Bandwidth = 955 MHz Typical
  • Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down-Mode
    Operation
  • Ron = 10 Ω Maximum
  • ΔRon <0.35 Ω Typical
  • Cio(ON) = 7 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human Body Model (HBM)
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • –3-dB Bandwidth = 955 MHz Typical
  • Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)

The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (955 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (955 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

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类型 标题 下载最新的英语版本 日期
* 数据表 High-Speed USB 2.0 1:2 Multiplexer/Demultiplexer Switch With Single Enable* 数据表 (Rev. F) 2015年 8月 14日
应用手册 Passive Mux Selection Based On Bandwidth > Ron 2019年 9月 11日
应用手册 Crosspoint Switch with TS3USB30 Device 2018年 8月 2日
应用手册 High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 2018年 6月 14日
应用手册 防止模拟开关的额外功耗 英语版 2008年 7月 15日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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UQFN (RSW) 10 查看选项

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包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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