TPS63820
- Input voltage range: 1.8V to 5.5V
- 2.0V minimum input voltage for start-up
- VOUT range: I2C-configurable 1.2V to 5.5V with 25mV step
- Output current
- Up to 3.5A for VIN ≥ 2.5V, VOUT = 3.3V
- Up to 4A for VIN ≥ 3V, VOUT = 3.3V
- High efficiency over the entire load range
- Low 2.3µA operating quiescent current
- Automatic power save mode, ultra-sonic mode, and forced PWM mode
- 91.94% efficiency at VIN = 3.6V, VOUT = 3.3V, IOUT = 100µA (in buck-boost mode)
- 95.33% efficiency at VIN = 3.6V, VOUT = 3.3V, IOUT = 2A (in buck-boost mode)
- Supports 1.2V logic I/O
- Three I2C target addresses available by ADDR pin connection
- Programmable soft start time, current limit, and buck-boost window
- Output discharge function
- Safety and robust protection features
- Overtemperature protection
- Input and output overvoltage protection
- True load disconnect during shutdown
- Forward and backward current limit
- Hiccup protection
- Two device options:
- TPS63820: Pre-programmed 3.3V VOUT
- TPS638201: Program VOUT prior to start-up
- 15-ball WCSP package (2.0mm × 1.2mm)
The TPS63820 and TPS638201 are low quiescent current, high output current buck-boost converters fully programmable through I2C. The 2.3µA quiescent current and four low Rdson MOSFETs enable high efficiency from a light to a heavy load range.
Depending on the input voltage, the devices automatically operate in boost, buck, or in buck-boost mode when the input voltage is approximately equal to the output voltage. The transitions between modes occur at defined thresholds and avoid unwanted toggling within the modes which reduces output voltage ripple.
The devices have a fast dynamic response, which enables the regulation of output voltage tightly, even in the event of heavy load transients.
The devices offer a small solution size in WCSP. The solution size is <20mm2 with only four external components.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TPS63820 – Low Quiescent Current, 4A Buck-Boost Converters with I2C Interface 数据表 | PDF | HTML | 2026年 3月 9日 | ||
| EVM 用户指南 | TPS63820 Evaluation Module | PDF | HTML | 2026年 3月 10日 |
设计与开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
TPS63820EVM — TPS63820 evaluation module
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| DSBGA (YBG) | 15 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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