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功能与比较器件相似
PTH03030W
- Up to 30-A Output Current
- 3.3-V Input Voltage
- Wide-Output Voltage Adjust (0.8 V to 2.5 V)
- 135 W/in³ Power Density
- Efficiencies up to 93%
- On/Off Inhibit
- Output Voltage Sense
- Pre-Bias Startup
- Margin Up/Down Controls
- Under-Voltage Lockout
- Auto-Track™ Sequencing
- Output Over-Current Protection (Non-Latching, Auto-Reset)
- Operating Temp: –40 to +85°C
- Over-Temperature Shutdown
- Safety Agency Approvals:
UL 1950, CSA 22.2 950, EN60950
VDE (Pending) - Point-of-Load Alliance (POLA) Compatible
The PTH03030 is a high-current non-isolated power module from Texas Instruments. The product is characterized by high efficiencies, and up to 30 A of output current, while occupying a mere 1.64 in² of PCB area. In terms of cost, size, and performance, the PTH03030 provides OEMs with a flexible module that meets the requirements of the most complex and demanding mixed-signal applications. These include the most densly populated, multi-processor systems that incorporate high-speed DSPs, microprocessors, and ASICs.
The series uses double-sided surface mount construction and provides high-performance step-down power conversion from a 3.3-V input bus voltage. The output voltage of the PTH03030W can be set to any value over the range 0.8 V to 2.5 V, using a single resistor.
This series includes Auto-Track. Auto-Track simplifies power-up and power-down supply voltage sequencing in a system by enabling modules to track each other, or any other external voltage.
Each model also includes an on/off inhibit, output voltage adjust (trim), and margin up/down controls. An output voltage sense ensures tight load regulation, and an output over-current and thermal shutdown feature provide for protection against external load faults.
Package options inlude both through-hole and surface mount connfigurations.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | PTH03030: 30 A, 3.3-V Input Wide-Output Adjust Power Module 数据表 (Rev. B) | 2004年 2月 2日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点