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CSDM65295T

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两相 180A 9mm x 10mm x 5mm TLVR 电源模块

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CSDM65295T

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产品详情

Rating Catalog Operating temperature range (°C) to
Rating Catalog Operating temperature range (°C) to
QFN-FCMOD (VCQ) 72 90 mm² 9 x 10
  • Topside-cooled 9 mm x 10 mm x 5 mm LGA package, industry common footprint
  • Integrated inductor
  • High output current capability:
    • Peak current: 180A
    • Continuous current: 130A RMS
    • (Subject to thermal boundary condition)
  • Operating VIN input voltage: 4.5V to 16V
  • Operating VDD Bias: 4.5V to 5.5V
  • High-frequency operation (up to 2MHz)
  • Integrated clamping circuitry for avalanche free operation
  • Temperature compensated bi-directional current sense with current mode reporting (5µA/A)
  • Body braking mode (BB)
  • Forced continuous conduction mode (FCCM) operation
  • Green, RoHS compliant without exemption, and completely Pb free
  • Fault detection
    • High-side short (HSS)
  • Fault protection
    • Over temperature (OT)
    • Cycle-by-cycle negative over current limiting (NOC)
    • Over current protection (OCP)
    • BOOT UVLO
  • Topside-cooled 9 mm x 10 mm x 5 mm LGA package, industry common footprint
  • Integrated inductor
  • High output current capability:
    • Peak current: 180A
    • Continuous current: 130A RMS
    • (Subject to thermal boundary condition)
  • Operating VIN input voltage: 4.5V to 16V
  • Operating VDD Bias: 4.5V to 5.5V
  • High-frequency operation (up to 2MHz)
  • Integrated clamping circuitry for avalanche free operation
  • Temperature compensated bi-directional current sense with current mode reporting (5µA/A)
  • Body braking mode (BB)
  • Forced continuous conduction mode (FCCM) operation
  • Green, RoHS compliant without exemption, and completely Pb free
  • Fault detection
    • High-side short (HSS)
  • Fault protection
    • Over temperature (OT)
    • Cycle-by-cycle negative over current limiting (NOC)
    • Over current protection (OCP)
    • BOOT UVLO

The CSDM65295x family of devices are 2-phase smart power stage modules with high peak current capability. The device family is highly optimized design for use in high-power, high-density synchronous buck converter applications. This product family integrates the driver IC and power MOSFETs into one Pb-free monolithic design to complete the power stage switching function. There are VIN and VDD bypass capacitors integrated into the package for minimum loop inductance and improved ringing.

This combination produces high-current, high-efficiency, and high-speed switching capability in a small industry standard 9mm × 10mm × 5 mm footprint.

CSDM65295x integrates accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. This power stage module also includes cycle-by-cycle current limiting, over temperature and short circuit protection, and is designed to be compatible with TPS537xx series controllers.

The CSDM65295x family of devices are 2-phase smart power stage modules with high peak current capability. The device family is highly optimized design for use in high-power, high-density synchronous buck converter applications. This product family integrates the driver IC and power MOSFETs into one Pb-free monolithic design to complete the power stage switching function. There are VIN and VDD bypass capacitors integrated into the package for minimum loop inductance and improved ringing.

This combination produces high-current, high-efficiency, and high-speed switching capability in a small industry standard 9mm × 10mm × 5 mm footprint.

CSDM65295x integrates accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. This power stage module also includes cycle-by-cycle current limiting, over temperature and short circuit protection, and is designed to be compatible with TPS537xx series controllers.

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* 数据表 CSDM65295x Dual-Phase Buck Smart Power Stage Module 数据表 PDF | HTML 2026年 2月 2日

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封装 引脚 CAD 符号、封装和 3D 模型
QFN-FCMOD (VCQ) 72 Ultra Librarian
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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