SLUS545E November   2002  – December 2015 UCC27423 , UCC27424 , UCC27425

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable
      2. 8.3.2 Input Stage
      3. 8.3.3 Output Stage
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Source and Sink Capabilities During Miller Plateau
        2. 9.2.2.2 Parallel Outputs
        3. 9.2.2.3 VDD
        4. 9.2.2.4 Drive Current and Power Requirements
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Related Products
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
  • DGN|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 Features

  • Industry-Standard Pin-Out
  • Enable Functions for Each Driver
  • High Current Drive Capability of ±4 A
  • Unique BiPolar and CMOS True Drive Output Stage Provides High Current at MOSFET Miller Thresholds
  • TTL/CMOS Compatible Inputs Independent of Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times with 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns with Input Falling and 35 ns with Input Rising
  • 4-V to 15-V Supply Voltage
  • Dual Outputs Can Be Paralleled for Higher Drive Current
  • Available in Thermally Enhanced MSOP PowerPAD™ Package
  • Rated From –40°C to 125°C

2 Applications

  • Switch Mode Power Supplies
  • DC/DC Converters
  • Motor Controllers
  • Line Drivers
  • Class D Switching Amplifiers

3 Description

The UCC2742x family of high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. It is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x provides enable (ENB) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8 which were previously left unused in the industry standard pin-out. They are internally pulled up to VDD for active high logic and can be left open for standard operation.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
UCC27423
UCC27424
UCC27425
SOIC (8) 4.90 mm × 3.91 mm
MSOP-PowerPAD (8) 3.00 mm × 3.00 mm
PDIP (8) 9.81 mm × 6.35 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Application Diagram

UCC27423 UCC27424 UCC27425 SLUS545sim_app_diagram.gif