ZHCSN70F November   2002  – November 2023 UCC27423 , UCC27424 , UCC27425

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Input Stage
      3. 7.3.3 Output Stage
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source and Sink Capabilities During Miller Plateau
        2. 8.2.2.2 Parallel Outputs
        3. 8.2.2.3 VDD
        4. 8.2.2.4 Drive Current and Power Requirements
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
  • DGN|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.1 Overview

The UCC2742x family of high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. It is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages. Using a design that inherently minimizes shoot-through current, these drivers deliver 4A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique Bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages. Table 7-1 highlights more details about UCC2742x.

Table 7-1 UCC2742x Features and Benefits
FEATUREBENEFIT
1-ns (typ) delay matching between channelsEase of paralleling outputs for higher (2 times) current capability, ease of driving parallel-power switches
Expanded VDD operating range of 4 to 15 VFlexibility in system design
Outputs enabled when enable pins (ENx) in floating conditionPin-to-pin compatibility with the UCC27324 device from Texas Instruments and industry standard pinout, in designs where Pin 1 and Pin 8 are in floating condition
CMOS/TTL compatible input and enable threshold with wide hysteresisEnhanced noise immunity, while retaining compatibility with microcontroller logic-level inputs signals (3.3 V, 5 V) optimized for digital power
Ability to handle –5 VDC (max) at input pins (INA/B)Increased robustness in noisy environments