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  • AWR6843Device Silicon ErrataSilicon Revision 2.0

    • SWRZ097D April   2020  – November 2022 AWR6843

       

  • CONTENTS
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  • AWR6843Device Silicon ErrataSilicon Revision 2.0
  1. 1Introduction
  2. 2Device Nomenclature
  3. 3Device Markings
  4. 4Usage Notes
    1. 4.1 MSS: SPI Speed in 3-Wire Mode Usage Note
  5. 5Advisory to Silicon Variant / Revision Map
  6. 6Known Design Exceptions to Functional Specifications
    1.     MSS#25
    2.     MSS#26
    3.     MSS#27
    4.     MSS#28
    5.     MSS#29
    6.     MSS#30
    7.     MSS#31
    8.     MSS#32
    9.     MSS#33
    10.     MSS#34
    11.     MSS#36
    12.     MSS#37B
    13.     MSS#38A
    14.     MSS#39
    15.     MSS#40
    16.     MSS#41
    17.     MSS#42A
    18.     MSS#43A
    19.     MSS#44A
    20.     MSS#45
    21. 6.1 MSS#50
    22. 6.2 MSS#51
    23.     ANA#11B
    24. 6.3 ANA#12A
    25.     ANA#13B
    26.     ANA#14
    27.     ANA#15
    28.     ANA#16
    29.     ANA#17A
    30.     ANA#18B
    31.     ANA#19
    32.     ANA#20
    33.     ANA#21
    34.     ANA#22A
    35.     ANA#27A
  7. 7Trademarks
    1.     Revision History
  8. IMPORTANT NOTICE
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ERRATA

AWR6843Device Silicon ErrataSilicon Revision 2.0

1 Introduction

This document describes the known exceptions to the functional and performance specifications to TI CMOS Radar Devices (AWR6843).

2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of Radar / mmWave sensor devices. Each of the Radar devices has one of the two prefixes: XAx or AWRx (for example: XA6843BGABL). These prefixes represent evolutionary stages of product development from engineering prototypes (XI) through fully qualified production devices (AWR).

Device development evolutionary flow:

XA — Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
AWR — Production version of the silicon die that is fully qualified.

XA devices are shipped with the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Texas Instruments recommends that these devices not to be used in any production system as their expected end –use failure rate is still undefined.

3 Device Markings

Figure 3-1 shows an example of the AWR6843 Radar Device's package symbolization.

GUID-87557687-0EDE-46C8-BC19-F6D8178C63EC-low.gif Figure 3-1 Example of Device Part Markings

This identifying number contains the following information:

  • Line 1: Device Number
  • Line 2: Safety Level and Security Grade
  • Line 3: Lot Trace Code
    • YM = Year/Month Code
    • Z = Assembly Site Code
    • LLL = Assembly Lot Code
    • 9 = Primary Site Code
  • Line 4:
    • 60 GHZi = AWR6843 (ES1.0) Identifier
    • 678A = AWR6843 (ES2.0) Identifier
    • ABL = Package Identifier
    • G1 = "Green" Package Build (must be underlined)

4 Usage Notes

Usage notes highlight and describe particular situations where the device's behavior may not match presumed or documented behavior. This may include behaviors that affect device performance or functional correctness. These usage notes will be incorporated into future documentation updates for the device (such as the device-specific data sheet), and the behaviors they describe will not be altered in future silicon revisions.

4.1 MSS: SPI Speed in 3-Wire Mode Usage Note

The maximum SPI speed under 3-wire operation was only tested up to 33 MHz. This affects AWR6843 ES2.0.

5 Advisory to Silicon Variant / Revision Map

Table 5-1 Advisory to Silicon Variant / Revision Map
Advisory Number Advisory Title AWR6843
ES2.0
Main Subsystem
MSS#25 Debugger May Display Unpredictable Data in the Memory Browser Window if a System Reset Occurs X
MSS#26 DMA Requests Lost During Suspend Mode X
MSS#27 MibSPI in Slave Mode in 3- or 4-Pin Communication Transmits Data Incorrectly for Slow SPICLK Frequencies and for Clock Phase = 1 X
MSS#28 A Data Length Error is Generated Repeatedly in Slave Mode When IO Loopback is Enabled X
MSS#29 Spurious RX DMA REQ From a Slave Mode MibSPI X
MSS#30 MibSPI RX RAM RXEMPTY Bit Does Not Get Cleared After Reading X
MSS#31 CPU Abort Generated on a Write to Implemented CRC Space After a Write to Unimplemented CRC Space X
MSS#32 DMMGLBCTRL BUSY Flag Not Set When DMM Starts Receiving A Packet X
MSS#33 MibSPI RAM ECC is Not Read Correctly in DIAG Mode X
MSS#34 HS Device Does Not Reboot Successfully on Warm Reset Getting Triggered by Watchdog Expiry X
MSS#36 DMA Read From an Unimplemented Address Space is not Reported as a BUS Error X
MSS#37B DCC Module Frequency Comparison can Report Erroneous Results X
MSS#38A GPIO Glitch During Power-Up X
MSS#39 The State of the MSS DMA is Left Pending and Uncleared on Any DMA MPU fault X
MSS#40 Any EDMA Transfer that Spans ACCEL_MEM1 +ACCEL_MEM2 Memories of Hardware Accelerator May Result in Data Corruption Without Any Notification of Error From the SoC X
MSS#41 Issuing WARM_RESET can Cause Bootloader Failure Which Results in Failure to Load the Application From Serial Flash X
MSS#42A DSP L2 memory initialisation can reoccur on execution DSP self test (STC) OR DSP Power cycling execution by application. X
MSS#43A Read-data From Internal Registers of PCR Is Not Reliable. Shared PCS Region Protection is Also Not Supported X
MSS#44A SYNC IN input pulse wider than 4usec can cause a FRC lockstep error X
MSS#45 Bootup Failure During the Serial Flash Busy State X
MSS#50 Occasional EDMA self-test failures X
MSS#51 Spurious toggle on nERROR OUT signal during powerup due to undefined state in ESM block. X
Analog / Millimeter Wave
ANA#11B TX, RX Calibrations Sensitive to Large External Interference X
Section 6.3 Second Harmonic (HD2) Present in the Receiver X
ANA#13B Phase Mismatch Variation Across Temperature in TX3/TX1 and TX3/TX2 Combinations are higher than that of TX2/TX1 Combination X
ANA#14 Doppler Spurs Observed for Narrow Chirps X
ANA#15 Excessive TX-RX Coupling or Reflection can Lead to Saturated RX Output X
ANA#16 LVDS Coupling to Clock System X
ANA#17A On-Board Supply Ringing Induced Spur X
ANA#18B Spurs Caused due to Digital Activity Coupling to XTAL X
ANA#19 Bandgap Decoupling Capacitor On-Board X
ANA#20 Occasional Failures Observed During Calibration of the Radar Subsystem X
Section 6.4 Out of Band Radiated Spectral Emission X
ANA#22A Overshoot and Undershoot During Inter-Chirp When Dynamic-Power Saving is Disabled X
ANA#27A Digital Temperature Sensor Readings Differ From Analog Temperature Sensors X

6 Known Design Exceptions to Functional Specifications

 

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