ZHCSSH5A August   2023  – December 2024 LOG200

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High Speed, Logarithmic Current-to-Voltage Conversion
      2. 6.3.2 Voltage and Current References
      3. 6.3.3 Adaptive Photodiode Bias
      4. 6.3.4 Auxiliary Operational Amplifier
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Logarithmic Transfer Function
        1. 7.1.1.1 Logarithmic Conformity Error
        2. 7.1.1.2 Error Analysis Example
    2. 7.2 Typical Application
      1. 7.2.1 Optical Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) LOG200 UNIT
RGT (VQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 66.7 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 61.8 ℃/W
RθJB Junction-to-board thermal resistance 39.8 ℃/W
ψJT Junction-to-top characterization parameter 3.8 ℃/W
ψJB Junction-to-board characterization parameter 39.8 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 31.2 ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.