UCC28781-Q1 是一款零电压开关 (ZVS) 控制器,可用于超高开关频率,从而充分减小变压器尺寸并实现高功率密度。
该控制器采用直接同步整流器 (SR) 控制,可直接驱动 SR FET,充分提高效率并简化设计,因此无需独立 SR 控制器。(隔离式应用需要隔离式栅极驱动器 IC。)
ZVS 采用自适应死区时间控制,可有效降低开关损耗和 EMI。该设计使控制器在整个工作范围内具有极高转换效率。
可编程自适应突发模式 (ABM) 可灵活控制控制器进入和退出待机模式的时机,从而降低轻负载和空载待机功耗。ABM 还有助于减少纹波并有效降低可闻噪声。
该控制器提供多种具有自动重启(重试)响应功能的保护模式。
器件型号 | 封装(1) | 封装尺寸 |
---|---|---|
UCC28781-Q1 | WQFN (24) | 4.00mm × 4.00mm |
DATE | REVISION | NOTES |
---|---|---|
November 2021 | * | Initial release. |
PIN | TYPE(1) | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
FLT | 1 | I | The controller enters into the fault state if the FLT-pin voltage is pulled above 4.5 V or below 0.5 V. A 50-µA current source interfaces directly with an external NTC (negative temperature coefficient) thermistor to AGND pin for remote temperature sensing. The current source is active during the run state and inactive during the wait state. A 50-µs fault delay allows a filter capacitor to be placed on the FLT pin without false triggering the 0.5-V OTP fault when the controller enters into a run state from a wait state. Alternatively, a high-resistance voltage divider can be used to sense the bulk input capacitor voltage for line-OVP detection, and a 750-µs fault delay helps to prevent false triggering the 4.5-V input line-OVP from a short-duration bulk capacitor voltage overshoot during line surge and ESD strike events. When FLT-pin voltage is used for line-OVP detection, the external OTP can be implemented on CS pin. |
RTZ | 2 | I | A resistor between this pin and AGND pin programs an adaptive delay for transition to zero voltage from the turn-off edge of the PWMH signal to the turn-on edge of the PWML signal. Parasitic capacitance between this pin and any other net, including AGND, must be minimized to avoid noise coupling and its effect on the dead-time calculation. |
RDM | 3 | I | A resistor between this pin and AGND pin programs a synthesized demagnetization time used to control the on-time of the PWMH signal to achieve zero voltage switching on the primary switch. The controller applies a voltage on this pin that varies with the output voltage derived from the VS pin signal. Parasitic capacitance between this pin and any other net, including AGND, must be minimized to avoid noise coupling and its effect on the internal PWMH on-time calculation. |
IPC | 4 | I | This pin is an intelligent power control (IPC) pin to optimize the converter efficiency. A 50-µA current source directly interfaces with a resistor (RIPC) to AGND pin to program an increase in the peak current level at very light load; the burst frequency can be further reduced, helping to achieve low standby power and tiny-load power. If the IPC pin is connected to AGND without RIPC, the peak current level in very light load is set to a minimum level for the output ripple or audible noise sensitive designs. RIPC can also be connected between this pin and the CS pin or IPC pin can be directly connected to CS pin, so the 50-µA IPC current can create an output voltage dependent offset voltage on the CS pin for reducing output ripple in adaptive burst mode and improving light-load efficiency at lower output voltage level of a wide output voltage range design. |
BUR | 5 | I | This pin is used to program the burst threshold of the converter at light load. A resistor divider between REF and AGND is used to set a voltage at BUR to determine the peak current level when the converter enters adaptive burst mode (ABM). In addition, the Thevenin resistance on BUR is used to activate offset voltages for smooth mode transitions. A 2.7-µA pull up current increases the peak current threshold when the converter enters low-power mode (LPM) from ABM. A 5-µA pull down current reduces the peak current threshold when the converter enters into high-power mode (adaptive amplitude modulation, AAM) from ABM. |
FB | 6 | I | A current signal is coupled to this pin to close the converter regulation feedback loop. This pin presents a 4.25-V output that is designed to have 0-µA to 75-µA current pulled out of the pin corresponding to the converter operating from full-power to zero-power conditions. A 220-pF filter capacitor between FB pin and REF pin is recommended to desensitize the feedback signal from noise interference. |
REF | 7 | O | This pin is a 5-V reference output that requires a 0.22-µF ceramic bypass capacitor to the AGND pin. This reference is used to power internal circuits and can supply a limited external load current. Pulling this pin low shuts down PWM action and initiates a VDD restart. |
AGND | 8 | G | Analog ground and the ground return of PWMH and RUN drivers. Return all analog control signals to this ground. |
CS | 9 | I | This is the current-sense input pin. This pin couples to the current-sense resistor through a line-compensation resistor to control the peak primary current in each switching cycle. An internal current source on this pin, proportional to the converter’s input voltage, creates an offset voltage across the line-compensation resistor to balance the over-power protection (OPP) threshold level across input line. The CS pin can also provide an alternative OTP function, when the FLT pin is being used for the line input-OVP. A small-signal diode in series with an NTC resistor is connected between PWMH pin and CS pin to form the OTP detection. When PWMH is high, the NTC resistor and the line-compensation resistor become a resistor divider from 5 V and creates a temperature dependent voltage on CS pin. When CS pin voltage is higher than 1.2 V in PWMH on state for 2 consecutive cycles, the OTP fault on CS pin is triggered. |
RUN | 10 | O | This output pin is high when the controller is in the run state. This output is low during start-up, wait, and fault states. A 2.2-µs timer delays the initiation of PWML switching after this pin has gone high and S13-pin voltage is above its 10-V power-good threshold. The pull-up driving capability of both RUN and PWMH pins allows bias power management of a digital isolator through a common-cathode small-signal diode, so the power consumption can be reduced in the wait state. |
PGND | 11 | G | Low-side ground return of the PWML driver to the
primary switch. The internal level shifter allows the common return
impedance to be eliminated and improves higher frequency operation
by decoupling the additional voltage spike on the current-sense
resistor and layout parasitic inductance of the gate driving loop.
For a silicon (Si) power FET, this pin can be connected to the
source for a smaller gate driving loop. For a GaN power IC with a
logic PWM input, this pin can be connected to AGND. For a GaN-based gate-injection transistor (GIT), this pin can be directly connected to the separate source pin of a GIT GaN device, which enhances the turn-off speed. |
PWML | 12 | O | Primary switch gate driver output. The high-current capability (-0.5A/+1.9A) of PWML enables driving of a silicon power MOSFET with higher capacitive loading, a GIT GaN with continuous on-state current, or a GaN power IC with logic input. The maximum voltage level of PWML is clamped to the P13 pin voltage. |
S13 | 13 | O | S13 is a switched bias-voltage source coupled to P13 through an internal 2.8-Ω switch controlled by the RUN pin. When RUN is high, the S13 decoupling capacitor is charged up to 13 V by an internal current limiter. The S13 pin voltage must increase above 10 V to initiate PWML switching. When RUN is low, S13 is discharged by its load. The power-on delay of any device powered by S13 must be less than 2 µs to be responsive to PWML. A 22-nF ceramic capacitor between S13 and the driver ground is recommended. S13 can also perform power management on a PFC controller at the same time through a diode, such that PFC can be disabled at very light-load condition. |
P13 | 14 | O | P13 is a regulated 13-V bias-voltage source derived from VVDD. During VVDD startup, P13 pin is connected to the VDD pin internally, so an external high-voltage depletion MOSFET, such as BSS126, can provide controlled startup current to charge the VDD capacitor. After the initial startup, P13 recovers back to 13-V regulation. A 1-µF ceramic bypass capacitor is required from P13 to AGND. A 20-V Zener diode between P13 and AGND is recommended to protect this pin from overstress, such as if the connection between this pin and the depletion MOSFET gate is fail-open or if line surge energy is coupled to this pin. |
PWMH | 15 | O | PWM output signal used to control the gate of a secondary-side synchronous rectifier (SR) MOSFET through an external isolating gate driver. The driving capability is designed to bias a level-shifting isolator through a small-signal diode, or can also transmit the signal to secondary-side driving circuitry through a pulse transformer. The maximum voltage level of PWMH is clamped to REF. |
SWS | 16 | I | This sensing input is used to monitor the switch-node voltage as it nears zero volts in normal operation for ZVS auto-tuning. The source of a high-voltage depletion-mode MOSFET, such as BSS126, is coupled to this pin through a current-limiting resistor so only the useful switching characteristic below 15 V is monitored. During start-up, this pin is connected to the VDD pin internally to allow the depletion-mode MOSFET to provide start-up current. The external current-limit resistor and a small bidirectional TVS across gate and source should be added to protect the VGS from potential abnormal voltage stress. The resistor should be higher than 500 Ω and less than 820 Ω. The clamping voltage of TVS should be less than the MOSFET voltage rating but greater than 15 V. Moreover, the resistor and a 22-pF ceramic capacitor between the SWS pin and the bulk input capacitor ground form a small sensing delay to help the internal detection circuit to identify the ZVS characteristic correctly. |
XCD | 17, 18 | I | X-cap Discharge input pins with 2-mA maximum discharge current capability. A line zero-crossing (LZC) threshold of 6.5 V on XCD is used to detect AC-line presence. When LZC is not detected within an 84-ms test period, the discharge current is enabled for a maximum period of 300 ms followed by a no-current blanking time of 700 ms. When AC-line recovers and LZC is detected again, the controller can reset the fault state almost immediately and will attempt to restart without waiting to fully discharge the bulk input capacitor. For the auto-recovery fault protections, if the controller is in 1.5-s auto-recovery fault state, LZC can reset the timer and speed up the restart attempt. The two redundant XCD pins help to provide the X-cap discharge function even when one pin is in fail-open condition. To form the discharge path, an anode of two high-voltage diode rectifiers is connected to each X-cap terminal, the two diode cathodes are connected together to a 26-kΩ high-voltage current-limiting resistance, and the drain-to-source connection of a high-voltage depletion MOSFET couples the resistance to the XCD pins. Two series 13-kΩ SMD resistors in 1206 size can be used as the current limiting device, and share the potential transient voltage from the AC-line. A 600-V rated MOSFET such as BSS126 is needed as the high voltage blocking device. The MOSFET gate is connected to the P13 pin, so the XCD pins can obtain enough signal headroom for LZC detection. If the X-cap discharge function is not needed, XCD pins must be connected to AGND pin to disable the function, and the diode-resistor-MOSFET path must be removed. |
VDD | 19 | P | Controller bias power input. A ceramic capacitor with 10-µF or 15-µF capacitance is recommended, and the minimum voltage rating is 25 V. |
GTP1 | 20 | G | Ground This Pin. This pin must be connected to AGND for proper operation of the device. |
GTP2 | 21 | G | Ground This Pin. This pin must be connected to AGND for proper operation of the device. |
GTP3 | 22 | G | Ground This Pin. This pin must be connected to AGND for proper operation of the device. |
VS | 23 | I | This voltage-sensing input pin is coupled to an auxiliary winding of the converter’s transformer via a resistor divider. The pin and associated external resistors are used to monitor the output and input voltages and switching edges of the converter at different moments within each switching cycle. Parasitic capacitance between VS and any net, including AGND, must be minimized to avoid adverse effects on output voltage sensing, edge detection, and the dead-time calculation. |
SET | 24 | I | This pin is used to configure the controller to be optimized for gallium nitride (GaN) power FETs or silicon (Si) power FETs on the primary side. Depending on the setting, it will optimize parameters of the ZVS control loop, dead-time adjustment, and protection features. When pulled high to REF pin, it is optimized for Si FETs. When pulled low to AGND, it is optimized for GaN FETs. |
Thermal Pad | G | The thermal pad (TP) must be connected to AGND. |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Input Voltage | VDD | 38 | V | |
SWS | –6 | 38 | ||
SWS (transient, negative pulse width of 20 ns max., duty cycle ≤ 1%) | –10 | 38 | ||
VDD-SWS | –20 | 38 | ||
CS | –0.3 | 3.6 | ||
VS | –0.75 | 7 | ||
VS (transient, 100 ns max.) | –1 | 7 | ||
PGND | –1 | 4 | ||
PGND (transient, 25 ns max.) | 5 | |||
RTZ, BUR, SET, RDM, IPC, FLT, FB | –0.3 | 7 | ||
XCD | –0.3 | 30 | ||
Output Voltage | REF, PWMH, RUN | –0.3 | 7 | V |
P13, S13, PWML | –0.3 | 20 | ||
Source Current | REF, P13, RTZ, RDM, IPC | Self–limiting | mA | |
S13 (average) | 15 | |||
VS | 2 | |||
VS (transient, 100 ns max.) | 2.5 | |||
FB | 1 | |||
RUN (continuous) | 5 | |||
PWML (continuous) | 50 | |||
PWMH (continuous) | 10 | |||
CS (transient, 30 ns max.) | 1 | |||
Sink Current | RUN (continuous) | 8 | mA | |
PWML (continuous) | 50 | |||
PWMH (continuous) | 10 | |||
SWS | Self–limiting | |||
XCD | 25 | |||
FLT | 0.3 | |||
Operating junction temperature, TJ | –40 | 150 | °C | |
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per AEC Q100-002(1) | ±2000 | V |
Charged device model (CDM), per AEC Q100-011 | ±500 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VVDD | Bias supply operating voltage | 14 | 34 | V | |
CVDD | VDD capacitor | 10 | µF | ||
CP13 | P13 bypass capacitor | 1 | µF | ||
CREF | REF bypass capacitor | 0.22 | µF | ||
TJ | Operating junction temperature | –40 | 140 | °C |
THERMAL METRIC(1) | UCC28781-Q1 | UNIT | |
---|---|---|---|
RTW (WQFN) | |||
24 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 43.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 31.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 20.3 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.5 | °C/W |
ΨJB | Junction-to-board characterization parameter | 20.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5.7 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
VDD INPUT | ||||||
IRUN(STOP) | Supply current, run state | No switching | 0.88 | 2.2 | 2.66 | mA |
IRUN(SW) | Supply current, run state | Switching, IVSL = 0 µA | 2.45 | 3 | 3.55 | mA |
IWAIT | Supply current, wait state | IFB = -85 µA, IVDD only | 465 | 540 | 658 | µA |
ISTART | Supply current, start state | VVDD = VVDD(ON) - 100 mV, VVS = 0 V | 150 | 235 | 301 | µA |
IFAULT | Supply current, fault state | fault state | 500 | 630 | µA | |
IVDD(LIMIT) | VDD startup current limit during startup | VVDD increasing, VSWS - VVDD = 1 V, VVDD = 16.5 V | 1.2 | 2 | 2.53 | mA |
VVDD(ON) | VDD turnon threshold | VVDD increasing | 16.2 | 17 | 17.91 | V |
VVDD(OFF) | VDD turnoff threshold | VVDD decreasing | 9.94 | 10.6 | 11.17 | V |
VVDD(PCT) | Offset to power cycle for long output voltage overshoot | Offset above VVDD(OFF), IFB = -85 µA | 1.54 | 2.2 | 2.98 | V |
P13 OUTPUT | ||||||
VP13 | P13 voltage level including load regulation | 0 mA to 60 mA out of P13, run state, VVDD = 20 V | 12.0 | 12.8 | 13.6 | V |
IP13(START) | Max sink current of P13 pin during startup | VP13 = 14 V | 1.53 | 2.2 | 3.04 | mA |
IP13(MAX) | Current sourcing limit of P13 pin | P13 shorted to AGND, VVDD = 20 V | 103.3 | 133 | 160 | mA |
VR13(LINE) | Line regulation of VP13 | VVDD = 15 V to 35 V | -6 | 2 | 8.7 | mV |
VP13(OV) | Over voltage fault threshold above VP13 | 1.35 | 2 | 2.54 | V | |
RP13 | Dropout resistance of P13 regulator switch between VDD and P13 pins | (VVDD - VP13) / 30 mA, VVDD = 11 V, 30 mA out of P13 | 8.5 | 13 | 22.7 | Ω |
S13 OUTPUT | ||||||
RS13 | RDS(on) of internal disconnect switch between P13 and S13 pins | (VP13 - VS13) / 30 mA, VVDD = 11 V, 30 mA out of S13 | 2.1 | 2.8 | 3.82 | Ω |
VS13_OK | S13_OK threshold to enable switching | VRUN = 5 V | 9.63 | 10.2 | 10.7 | V |
IS13(MAX) | Current sourcing limit of S13 pin | S13 shorted to AGND, VVDD = 20 V | 260.7 | 350 | 452.5 | mA |
REF OUTPUT | ||||||
VREF | REF voltage level | IREF = 0 A | 4.9 | 5 | 5.13 | V |
IREF(MAX) | Current sourcing limit of REF pin | REF shorted to AGND, VVDD = 20 V | 14.3 | 17 | 20.3 | mA |
VR5(LINE) | Line regulation of VREF | VVDD = 12 V to 35 V | -7 | -3 | 1 | mV |
VR5(LOAD) | Load regulation of VREF | 0 mA to 1 mA out of REF, Change in VREF | -16 | 0.1 | 25 | mV |
VS INPUT | ||||||
VVSNC | Negative clamp level | IVSL = -1.25 mA, voltage below ground | 221 | 287 | 344 | mV |
VZCD | Zero-crossing detection (ZCD) level | VVS decreasing | 12.4 | 35 | 67.2 | mV |
IVSB | Input bias current | VVS = 4 V | -0.23 | 0 | 0.31 | µA |
VVS(SM1) | VS threshold voltage in SM1 startup mode | 242.4 | 282 | 318.3 | mV | |
VVS(SM2) | VS threshold voltage in SM2 startup mode | 458.3 | 500 | 543 | mV | |
VVSLV(UP) | VS upper threshold out of low output voltage mode (LV mode) | VVS increasing | 2.41 | 2.49 | 2.6 | V |
VVSLV(LR) | VS lower threshold into low output voltage mode (LV mode) | VVS decreasing | 2.3 | 2.39 | 2.49 | V |
tZC | Zero-crossing timeout delay | 1.95 | 2.3 | 2.73 | µs | |
tD(ZCD) | Propagation delay from ZCD high to PWML 10% high | VVS step from 4 V to -0.1 V | 23 | 50 | 81 | ns |
CS INPUT | ||||||
VCST(MAX) | Peak-power threshold on CS pin out of LV mode | IVSL = 0 μA, VVS ≥ VVSLV(UP) | 767.4 | 801 | 836.4 | mV |
IVSL = -333 μA, VVS ≥ VVSLV(UP) | 650 | 727 | 788.7 | mV | ||
IVSL = -666 μA, VVS ≥ VVSLV(UP) | 570 | 600 | 651.8 | mV | ||
IVSL = -1.25 mA, VVS ≥ VVSLV(UP) | 537.2 | 570 | 612 | mV | ||
VCST(MAX)_LV | Peak-power threshold on CS pin in LV mode | IVSL = 0 mA, VVS ≤ VVSLV(LR) | 593.7 | 628 | 663.9 | mV |
IVSL = -666 μA, VVS ≤ VVSLV(LR) | 540 | 570 | 609.5 | mV | ||
IVSL = -1.25 mA, VVS ≤ VVSLV(LR) | 511.2 | 540 | 584.7 | mV | ||
VCST(MIN) | Minimum CS threshold voltage | VCS increasing, IFB = -85 µA | 120.7 | 153 | 200.1 | mV |
KLC | Line-compensation current ratio | IVSL = -1.25 mA, IVSL / current out of CS pin | 21.6 | 25 | 29 | A/A |
VCST(EMI)(1) | EMI dithering magnitude on CS pin out of LV mode | (VBUR / KBUR-CST) < VCST < VCST(MAX), IVSL > -646 μA, VVS ≥ VVSLV(UP) | 78.4 | 96 | 113.6 | mV |
VCST(EMI)_LV(1) | EMI dithering magnitude on CS pin in LV mode | (VBUR / KBUR-CST) < VCST < VCST(MAX), IVSL > -646 μA, VVS ≤ VVSLV(LR) | 29.3 | 36 | 42.7 | mV |
VCST(SM1) | CS threshold voltage in SM1 startup mode | VVS < VVS(SM1) | 177.5 | 200 | 222.9 | mV |
VCST(SM2) | CS threshold voltage in SM2 startup mode | VVS < VVS(SM2) | 470.4 | 500 | 531.4 | mV |
tCSLEB | Leading-edge-blanking time | VSET = 5 V, VCS = 1 V | 171.2 | 190 | 216.1 | ns |
VSET = 0 V, VCS = 1 V | 94.4 | 108 | 125 | ns | ||
tD(CS) | Propagation delay of CS comparator high to PWML 90 % low | VCS step from 0 V to 1 V | 10 | 26 | 37 | ns |
fDITHER(1) | EMI dithering frequency on CS pin | (VBUR / KBUR-CST) < VCST < VCST(OPP), IVSL > -646 μA | 20 | 23 | 27 | kHz |
BUR INPUT and Low-power MODE | ||||||
KBUR-CST | Ratio of VBUR to VCST | VBUR between 0.7 V and 2.4 V | 3.82 | 3.98 | 4.09 | V/V |
IBUR(LPM) | Bias source current of VBUR offset in LPM | 2.09 | 2.65 | 3.16 | µA | |
IBUR(AAM) | Bias sink current of VBUR offset in AAM | VCST > VBUR / KBUR-CST | 3.76 | 4.85 | 5.81 | µA |
fBUR(UP1) | First upper threshold of burst frequency in ABM | 30.7 | 34.4 | 38.5 | kHz | |
fBUR(UP2) | Second upper threshold of burst frequency in ABM | VVS = 2.2 V | 41.8 | 51.2 | 58.9 | kHz |
fBUR(LR) | Lower threshold of burst frequency in ABM | 21.3 | 24.5 | 28.1 | kHz | |
fLPM | Burst frequency in low-power mode | 23.3 | 25 | 26.9 | kHz | |
IPC INPUT and SBP2 MODE | ||||||
VCST_IPC(UP) | Highest programmable VCST range of SBP2 by IPC pin | VIPC = 5 V | 373.8 | 405 | 438.5 | mV |
KIPC | Ratio of the programmable IPC voltage to VCST | VIPC between 1.8 V and 3.8 V | 59.3 | 64 | 68.4 | mV/V |
VCST_IPC(LR) | Lowest programmable VCST range of SBP2 by IPC pin | VIPC = 1 V | 247.5 | 273 | 307.7 | mV |
VCST_IPC(MIN) | Minimum VCST of SBP2 by grounding IPC pin | VIPC = 0 V | 128.1 | 154 | 191.5 | mV |
IIPC(SBP2) | Bias source current of VIPC offset in SBP2 | IFB = -85 µA | 40.7 | 49 | 55.7 | µA |
fSBP2(UP) | Upper threshold of burst frequency in SBP2 | 6 | 8.5 | 13.4 | kHz | |
fSBP2(LR) | Lower threshold of burst frequency in SBP2 | VIPC = 2 V | 1 | 1.7 | 2 | kHz |
RUN | ||||||
VRUNH | RUN pin high-level | IRUN = -0.2 mA | 4.6 | 4.78 | 5 | V |
VRUNL | RUN pin low-level | IRUN = 1 mA | 0.1 | 0.25 | 0.3 | V |
ISRC(RUN) | RUN peak source current | VRUN = 2.3 V | 33 | 44 | 52 | mA |
VRUN = 3 V | 14 | 20 | 25 | mA | ||
tR(RUN) | Turn-on rise time of RUN pin, from 0 V to 2.5 V | CLOAD = 22 nF, VRUN from 0 V to 2.5 V | 0.2 | 0.79 | 1 | µs |
tF(RUN) | Turn-off fall time of RUN pin, 90 % to 10 % | CLOAD = 10 pF | 20 | 32 | ns | |
PWML | ||||||
VPWMLH | PWML pin high-level | IPWML = -1 mA | 12.1 | 12.85 | 13.6 | V |
VPWMLL | PWML pin low-level | IPWML = 1 mA | 0.002 | 0.1 | V | |
ISRC(PWML)(1) | PWML peak source current | VPWML = 0 V | 0.25 | 0.5 | 0.8 | A |
ISNK(PWML)(1) | PWML peak sink current | VPWML = 13 V | 1.2 | 1.9 | 2.8 | A |
RSRC(PWML) | PWML pull-up resistance | IPWML = -20 mA | 3.1 | 4.3 | 6.1 | Ω |
RSNK(PWML) | PWML pull-down resistance | IPWML = 20 mA | 0.5 | 1.1 | 1.9 | Ω |
tR(PWML) | Turn-on rise time of PWML pin, 10 % to 90 % | CLOAD = 1.5 nF | 30 | 53 | ns | |
tF(PWML) | Turn-off fall time of PWML pin, 90 % to 10 % | CLOAD = 1.5 nF | 9 | 20 | ns | |
tD(RUN-PWML) | Delay from RUN high to PWML high | VS13 > 11 V | 1.92 | 4.7 | 7.43 | µs |
tON(MIN) | Minimum on-time of PWML in LPM | VSET = 5 V, IFB = -85 µA, VCS = 1 V | 68 | 105 | 180 | ns |
PWMH | ||||||
VPWMHH | PWMH pin high-level | IPWMH = -1 mA | 4.39 | 4.66 | 4.83 | V |
VPWMHL | PWMH pin low-level | IPWMH = 1 mA | 0.1 | 0.198 | 0.21 | V |
ISRC(PWMH) | PWMH peak source current | VPWMH = 2.5 V | 16.5 | 21 | 26.2 | mA |
VPWMH = 3.5 V | 3.8 | 6 | 7.6 | mA | ||
tR(PWMH) | Turn-on rise time of PWMH pin, 10 % to 90 % | CLOAD = 10 pF | 8 | 24 | ns | |
tF(PWMH) | Turn-off fall time of PWMH pin, 90 % to 10 % | CLOAD = 10 pF | 22 | 29 | ns | |
tD(VS-PWMH) | Dead time between VS high and PWMH 10 % high | 10 | 18 | 28 | ns | |
PROTECTION | ||||||
VOVP | Over-voltage threshold | VVS increasing | 4.4 | 4.55 | 4.67 | V |
VOCP | Over-current threshold | VCS increasing | 1.14 | 1.22 | 1.27 | V |
KOPP-PPL | Ratio of over-power threshold to peak-power threshold | VCST(OPP) / VCST(MAX) , and VCST(OPP)_LV / VCST(MAX)_LV | 0.72 | 0.75 | 0.78 | V/V |
IVSL(RUN) | VS line-sense run current | Current out of VS pin increasing | 313 | 365 | 408.6 | µA |
IVSL(STOP) | VS line-sense stop current | Current out of VS pin decreasing | 255 | 305 | 336.4 | µA |
KVSL | VS line sense ratio | IVSL(STOP) / IVSL(RUN) | 0.72 | 0.836 | 0.9 | A/A |
RRDM(TH) | RRDM threshold for CS pin fault | 35 | 55 | 70 | kΩ | |
TJ(STOP)(1) | Thermal-shutdown temperature | Internal junction temperature | 125 | 162 | °C | |
tOPP | OPP fault timer | IFB = 0 A | 130 | 164 | 210 | ms |
tBO | Brown-out detection delay time | IVSL < IVSL(STOP) | 28.8 | 55 | 85.2 | ms |
tCSF1 | Maximum PWML on-time for detecting CS pin fault | VSET = 5 V | 1.6 | 2.05 | 2.5 | µs |
tCSF0 | Maximum PWML on-time for detecting CS pin fault | RRDM < RRDM(TH) for VSET = 0 V | 0.85 | 1.05 | 1.27 | µs |
tFDR | Fault reset delay timer | OCP, OPP, OVP, SCP or CS pin fault | 1.2 | 1.5 | 2.4 | s |
FLT INPUT | ||||||
VNTCTH | NTC shut-down voltage | FLT voltage decreasing | 0.47 | 0.5 | 0.52 | V |
RNTCTH | NTC shut-down resistance | RNTC decreasing | 8.9 | 9.91 | 11.18 | kΩ |
RNTCR | NTC recovery resistance | RNTC increasing | 21.2 | 23 | 26.4 | kΩ |
IFLT | Input bias current for VFLT at VIOVPTH | VFLT = 4.5 V | -0.1 | 0 | 0.1 | µA |
VIOVPTH | Shut-down voltage of input OVP | FLT voltage increasing | 4.3 | 4.5 | 4.67 | V |
VIOVPR | Hysteresis of input OVP | FLT voltage increasing | 57.7 | 74 | 87 | mV |
tFLT(NTC) | Delay time of NTC fault | 14 | 50 | 100 | µs | |
tFLT(IOVP) | Delay time of input OVP fault | 555 | 750 | 917 | µs | |
VFLTZ | Clamp voltage of FLT pin | IFLT = 150 µA | 5.08 | 5.5 | 5.61 | V |
RTZ INPUT | ||||||
KTZ | tZ compensation ratio | ratio of tZ at IVSL = -200 µA to tZ at IVSL = -733 µA | 1.27 | 1.41 | 1.54 | s/s |
tZ(MAX) | Maximum programmable dead time from PWMH low to PWML high | RRTZ = 280 kΩ, IVSL = -1 mA, VSET = 5 V | 397.8 | 478 | 592.8 | ns |
tZ(MIN) | Minimum programmable dead time from PWMH low to PWML high | RRTZ = 78.4 kΩ, IVSL = -1 mA, VSET = 0 V | 56.1 | 70 | 89.1 | ns |
tZ | Dead time from PWMH low to PWML high | IVSL = -200 µA | 152.2 | 175 | 212.7 | ns |
IVSL = -450 µA | 129.2 | 150 | 190 | ns | ||
IVSL = -733 µA | 109.7 | 125 | 147.2 | ns | ||
SWS INPUT | ||||||
VTH(SWS) | SWS zero voltage threshold | VSET = 5 V | 8.1 | 8.5 | 9.1 | V |
VSET = 0 V | 3.7 | 4.04 | 4.4 | V | ||
tD(SWS-PWML) | Time between SWS low to PWML 10 % high | VSWS step from 5 V to 0 V | 11.4 | 17 | 26 | ns |
FB INPUT | ||||||
IFB(SBP) | Maximum control FB current | IFB increasing | 64.2 | 75 | 87.1 | µA |
VFB(REG) | Regulated FB voltage level | 4.02 | 4.25 | 4.53 | V | |
RFBI | FB input resistance | 7.4 | 8.3 | 9.6 | kΩ | |
dICOMP/dt(1) | Slope of internal ramp compensation current | 0.192 | 0.214 | 0.236 | A/s | |
ICOMP | Magnitude of internal ramp compensation current | 4 | 6.75 | 8 | µA | |
RDM INPUT | ||||||
tDM(MAX) | Maximum PWMH width with maximum tuning | VSWS = 12 V | 6.0 | 6.95 | 7.53 | µs |
tDM(MIN) | Minimum PWMH width with minimum tuning | VSWS = 0 V | 3.0 | 3.43 | 3.77 | µs |
XCD INPUT | ||||||
VXCD(LR) | XCD lower zero-crossing threshold | 5.9 | 6.62 | 7.2 | V | |
VXCD(UP) | XCD upper zero-crossing threshold | 6.8 | 7.5 | 7.9 | V | |
IXCD(0) | Leakage current in XCD wait state | VXCD = 15 V | 0.3 | 1.7 | µA | |
IXCD(1) | First-step XCD sense current | VXCD = 15 V | 0.32 | 0.4 | 0.46 | mA |
IXCD(2) | Second-step XCD sense current | VXCD = 15 V | 0.61 | 0.775 | 0.91 | mA |
IXCD(3) | Third-step XCD sense current | VXCD = 15 V | 0.73 | 1.15 | 1.6 | mA |
IXCD(4) | Fourth-step XCD sense current | VXCD = 15 V | 1.2 | 1.53 | 1.81 | mA |
IXCD(MAX) | Maximum XCD discharge current | VXCD = 15 V | 1.65 | 2 | 2.5 | mA |
VXCD(OVP) | Clamp voltage of XCD OVP | IXCD = 20 mA | 23 | 26 | 30 | V |
tXCD(STEP) | Dwell time for each XCD sense step | 9 | 12 | 14.6 | ms | |
tXCD(MAX) | Maximum XCD discharge time | 230.4 | 300 | 373.3 | ms | |
tXCD(WAIT) | XCD wait time | 700 | 1071 | ms |
VVDD = 20 V, RRDM = 115 kΩ, RRTZ = 140 kΩ, VSET = 0 V, and TJ = TA = 25 ⁰C (unless otherwise noted)
The UCC28781-Q1 is a transition-mode zero-voltage-switching flyback (ZVSF) controller equipped with advanced control schemes to enable significant size reduction of passive components for higher power density and higher average efficiency. Its control law is optimized for Silicon (Si) and Gallium Nitride (GaN) power FETs in a single-switch flyback configuration at high frequencies. In burst mode at very light loads the switching frequency may increase up to 1.5 MHz.
The ZVSF control of the UCC28781-Q1 is capable of auto-tuning the on-time of a secondary-side synchronous rectifier switch (QSR) by using a unique lossless ZVS-sensing network connected between the switch-node voltage (VSW) and the SWS pin. The ZVSF controller is designed to adaptively achieve targeted full-ZVS or partial-ZVS conditions for the primary-side main switch (QL) with minimum circulating energy over wide operating conditions. Auto-tuning eliminates the risk of losing ZVS due to component tolerance, temperature, and input/output voltage variations, since the QSR on-time is corrected cycle-by-cycle.
Dead-times between PWML (controls QL) and PWMH (controls QSR) are optimally adjusted to help minimize the circulating energy required for ZVS as operating conditions change. Therefore, the overall system efficiency is improved and more consistent in mass production of the soft-switching topology. The programming features of the RTZ, RDM, BUR, IPC, and SET pins provide rich flexibility to optimize the power stage efficiency across a range of output power and operating frequency levels.
The UCC28781-Q1 uses five different steady-state operating modes to maximize efficiency over wide load and line ranges:
During the system transient events such as the output load step down and output voltage overshoots, VVDD may be reduced close to the 10.5-V UVLO-off threshold. In such cases, a sixth non-steady-state mode called survival mode (SM) is triggered to maintain VVDD above 13 V and to reduce the size of the hold-up VDD capacitor.
The switching frequency-dither function is active in AAM to help reduce conducted-EMI noise and allow EMI filter size reduction. The 23-kHz dithering pattern and magnitude are designed to avoid audible noise, minimize efficiency influence, and desensitize the effect of the output voltage feedback loop response effect on the EMI attenuation. The dither function at low line can be programmed into disable mode based on the brown-in voltage setting, so the option provides design flexibility to balance the worst-case low-line efficiency and EMI. The dither fading feature smoothly disables the dither signal when the output load is close to the transition point between AAM and ABM. The 23-kHz dither frequency is high enough to allow a higher control-loop bandwidth for improved load transient response without distorting the dither signal and impairing EMI.
The unique burst mode control in ABM, LPM, and two SBP modes maximizes the light-load efficiency of the ZVSF power stage while avoiding the concerns of conventional burst operation - such as high output ripple and audible noise. The internal ramp compensation can stabilize the burst control loop without an external compensation network. The burst control provides an enable signal through the RUN pin to dynamically manage the static current of the SR gate-driver and also adaptively disables the drive signal of QSR. The internal drivers of RUN and PWMH can supply and disconnect the 5-V bias voltage to a digital isolator through a small-signal diode. The disconnect switch inside the S13 pin can directly control the 13-V bias voltage to a low-side GaN driver. These power management functions with RUN, PWMH, and S13 pins can be used to minimize the quiescent power consumed by those devices during burst off time, further improving the converter’s light-load efficiency and reducing its stand-by power.
The S13 and IPC pins of the UCC28781-Q1 can be adapted to manage an upstream PFC stage to maximize the light-load efficiency of higher power applications. The S13 pin can supply a 13-V bias voltage to the PFC controller whenever the ZVSF controller is in the run state. The pin disconnects the bias voltage during the wait states of the burst mode operation. When the burst frequency is reduced in very light load conditions, the bias voltage will decay below UVLO and shut down PFC controller, so the power loss from PFC can be eliminated.
The PWML output is a strong driver for a Si power MOSFET with high capacitive loading, a GaN-based gate injection transistor (GIT) with continuous on-state current, or a GaN power IC with logic input. The maximum voltage level of PWML is clamped at 13 V to balance the conduction loss reduction and gate charge loss of Si MOSFET. A dedicated driver ground return pin (PGND) minimizes the parasitic impedance and noise coupling of the PWML gate-drive loop to achieve faster switching speed and reduced turn-off loss of QL. The short 15-ns propagation delay and narrow 110-ns minimum on-time enable more accurate ZVS control and higher switching frequency operation.
During initial power up or VDD restart, the ZVSF stops switching, so UCC28781-Q1 starts up the VDD supply voltage with an external high-voltage depletion-mode MOSFET between the ZVSF switch node and the SWS pin. Fast startup is achieved with low stand-by power overhead, compared with using the conventional high-voltage startup resistance to VDD. Moreover, the P13 pin biases the gate of the depletion-mode FET to also allow this MOSFET to be used in lossless ZVS-sensing. This arrangement avoids additional sensing devices.
The enhanced switching control of UCC28781-Q1 mitigates excessive drain-to-source voltage stress on a synchronous rectifier (SR) caused by temporary continuous conduction mode (CCM), so the power loss of an SR snubber can be reduced for higher efficiency. Additional PWML timing controls can avoid premature QL turn-on before the magnetizing current reaches to zero through an improved zero-crossing detection (ZCD) scheme of the VS pin.
The UCC28781-Q1 also integrates more robust protection features tailored to maximize system reliability and safety. These features include active X-capacitor discharge, internal soft start, brown in/out, output over-voltage (OVP), input line over-voltage (IOVP), output over-power (OPP), system over-temperature (OTP), switch over-current (OCP), output short-circuit protection (SCP), and pin faults. All fault responses are auto-recovery, which means that the controller will attempt to restart after the shut-down time elapses.
The X-capacitor discharge function can actively discharge the residual voltage on X2 safety capacitors to a safe level after AC-line voltage removal is detected through the XCD pins of UCC28781-Q1 and its external sensing circuit. If the AC-line voltage recovers within 2 seconds after the line removal, the controller will reset the fault state immediately and will attempt to restart without waiting to fully discharge the bulk input capacitor or VDD capacitor. Grounding the two XCD pins disables this function and eliminates the sensing circuit. Unlike other conventional flyback controllers, UCC28781-Q1 provides the design flexibility of using the X-capacitor discharge function based on application power level as it is decoupled from VDD startup and brown-in/out detection functions. Since those two functions are implemented on the SWS and VS pins, respectively, UCC28781-Q1 maintains the two functions even when the XCD-related components are fully removed.
The voltage at the BUR pin (VBUR) sets a target peak current-sense threshold at the CS pin (VCST(BUR)) which programs the onset of adaptive burst mode (ABM). VBUR also determines the clamped peak current level of switching cycles in each burst packet. When VBUR is set higher, ABM will start at heavier output load conditions with higher peak primary current, so the benefit is higher light-load efficiency but the side effect is larger burst-mode output voltage ripple. Therefore, 50% to 60% of output load at high line is the recommended highest load condition to enter ABM (Io(BUR)) for both Si and GaN-based designs. The gain between VBUR and VCST(BUR) is a constant gain of KBUR-CST, so setting VCST(BUR) just requires properly selecting the resistor divider on the BUR pin formed by RBUR1 and RBUR2. VBUR should be set between 0.7 V and 2.4 V. If VBUR is less than 0.7 V, VCST(BUR) holds at 0.7 V / KBUR-CST. If VBUR is higher than 2.4 V, VCST(BUR) stays at 2.4 V / KBUR-CST.
In order to enhance the mode transition between ABM and LPM, a programmable offset voltage (ΔVBUR(LPM)) is generated on top of the VBUR setting in ABM through an internal 2.7-μA current source (IBUR(LPM)), as shown in Figure 7-1. In ABM, VBUR is set through the resistor voltage divider to fulfill the target average efficiency. On transition from ABM to LPM, IBUR(LPM) is enabled in LPM and flows out of the BUR pin, so ΔVBUR(LPM) can be programmed based on the Thevenin resistance on the BUR pin, which can be expressed as
When VBUR steps higher on transition into LPM, the initial peak magnetizing current in LPM is increased with larger energy per switching cycle in each burst packet. This increases the output voltage which forces higher feedback current to restore regulation. Higher feedback current causes UCC28781-Q1 to stay in LPM, forming a hysteresis effect. If ΔVBUR(LPM) is designed too small, it is possible that mode toggling between LPM and ABM can occur resulting in audible noise. For that situation, ΔVBUR(LPM) greater than 100 mV is recommended.
To minimize the effects of external noise coupling on VBUR, a filter capacitor on the BUR pin (CBUR) may be needed. CBUR needs to be properly designed to minimize the delay in generating ΔVBUR during mode transitions. It is recommended that CBUR should be sized small enough to ensure ΔVBUR(LPM) settles within 40 μs, corresponding to the burst frequency of 25 kHz in LPM (fLPM). Based on three RC time constants, representing 95% of a settled steady-state value from a step response, the design guide for CBUR is expressed as
In order to enhance the mode transition between ABM and AAM, a programmable offset voltage (ΔVBUR(AAM)) is generated to lower the VBUR with an internal 5-μA pull-down current (IBUR(AAM)), as shown in Figure 7-1. After transition from ABM to AAM, IBUR(AAM) is enabled in AAM and flows into the BUR pin, so ΔVBUR(AAM) is also programmed based on the Thevenin resistance on the BUR pin, which can be expressed as
When VBUR reduces after transition to AAM, the initial peak magnetizing current in AAM is reduced with less energy per switching cycle, which forces controller to continu operating in AAM. If ΔVBUR(AAM) is too small, it is possible that either mode toggling between ABM and AAM or low-frequency ABM burst packets less than 20 kHz can occur and result in audible noise concern. For that situation, ΔVBUR(AAM) greater than 150 mV is recommended. In some power stage designs, LPM in hard switching condition may cover a wider output load current range, so the light-load efficiency in LPM may be lower than ABM with ZVS condition. Besides, the ABM-to-AAM mode transition may be affected potentially when the load current condition of LPM-to-ABM transition is too close to the load current condition of ABM-to-AAM transition.
In order to optimize the output load current range in LPM, lower VBUR(ABM), smaller ΔVBUR(LPM), larger ROPP, and smaller CCS help to reduce the peak magnetizing current in LPM. If the LPM energy needs to be further reduced but VBUR in AAM is limited by the 0.7-V minimum programmable level, the optional application circuit in Figure 7-2 can be considered. When the output load current is reduced, duty cycle of each burst packet becomes smaller, so as the duty cycle of RUN-pin voltage. CBUR is discharged by the RUN driver through the small-signal diode (DBUR) and the current limit resistor (RRUN). Proper selection of RRUN value can further reduce VBUR(ABM) when the load current is reduced close to the transition point from ABM to LPM. One example BUR-pin setting is RBUR1 = 182 kΩ, RBUR2 = 37.4 kΩ, CBUR = 330 pF, and RRUN = 20 kΩ.
The FB pin usually connects to the collector of an optocoupler output transistor through an external current-limiting resistor (RFB). A maximum of 20 kΩ for RFB is recommended. The feedback network of UCC28781-Q1 is shown in Figure 7-3. A high-quality ceramic by-pass capacitor between FB pin and REF pin (CFB) is required for decoupling IFB from switching noise interference. A minimum of 220 pF is recommended for CFB . An internal 8-kΩ resistor (RFBI) at the FB pin in conjunction with the external CFB forms an effective low-pass filter. Section 8 provides a detailed design guide on the secondary-side compensation network of VO feedback loop, to improve the load transient response and also limit the IFB ripple of ABM mode within the recommended range.
Depending on the operating mode, the controller interprets the current flowing out of the FB pin (IFB) to regulate the output voltage. For AAM and LPM modes based on peak current control, IFB is converted into an internal peak current-sense threshold (VCST) to modulate the amplitude of the current-sense signal on the CS pin. For example, when the output voltage (VO) is lower than the regulation level set by the shunt regulator, the absolute current level of IFB reduces, causing a higher VCST to increase more power to the output load. In ABM, the burst control loop takes over the VO regulation, where VCST is clamped to VCST(BUR) and the ripple component of IFB participates in the modulation of the burst off time.
Figure 7-4 illustrates the operating principle of the ABM. A burst of switching pulses raises the output voltage VO which increases IFB. At the end of the burst, the load current discharges the output capacitor, which decreases VO and IFB. UCC28781-Q1 injects a noise-free internal ramp compensation current (ICOMP) superimposed on IFB in order to stabilize the ABM operation. When the RUN pin is high, ICOMP is reset to 0 μA. When the RUN pin goes low, ICOMP is gradually increased to 6 μA with a positive slope of 0.214 A/s. The summation of IFB and ICOMP is compared with ITH(FB) to trigger the next burst event. The magnitude and sharp slope of ICOMP help to push switching ripple and high-frequency noise component of IOPTO away from ITH(FB).
The output of the internal 5-V regulator of the controller is connected to the REF pin. REF provides bias current to most of the functional blocks within the UCC28781-Q1. It requires a high-quality ceramic by-pass capacitor (CREF) to AGND to decouple switching noise and to reduce the voltage transients as the controller transitions from wait state to run state. The minimum CREF value is 0.22 μF, and a high quality dielectric material should be used, such as X7R.
The output short-circuit current (IS(REF)) of the REF regulator is self-limited to approximately 17 mA. 5-V bias is only available after the under-voltage lock-out (UVLO) circuit enables the operation of UCC28781-Q1 when VVDD reaches VVDD(ON).
This pin can be used to perform an external shutdown function. A small-signal switch can be used to pull this pin voltage below the power-good threshold of 4.5V so the controller will stop switching, force a VDD restart cycle, and turn off the REF current.