ZHCSG31C March   2017  – December 2024 ISO7710-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
  7. 6 Absolute Maximum Ratings
  8. 7 ESD Ratings
  9. 8 Recommended Operating Conditions
  10. 9 Thermal Information
  11. 10Power Ratings
  12. 11Insulation Specifications
  13. 12Safety-Related Certifications
  14. 13Safety Limiting Values
  15. 14Electrical Characteristics—5-V Supply
  16. 15Supply Current Characteristics—5-V Supply
  17. 16Electrical Characteristics—3.3-V Supply
  18. 17Supply Current Characteristics—3.3-V Supply
  19. 18Electrical Characteristics—2.5-V Supply 
  20. 19Supply Current Characteristics—2.5-V Supply
  21. 20Switching Characteristics—5-V Supply
  22. 21Switching Characteristics—3.3-V Supply
  23. 22Switching Characteristics—2.5-V Supply
  24. 23Parameter Measurement Information
  25. 24Detailed Description
    1. 24.1 Overview
    2. 24.2 Functional Block Diagram
    3. 24.3 Feature Description
      1. 24.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 24.4 Device Functional Modes
      1. 24.4.1 Device I/O Schematics
  26. 25Application and Implementation
    1. 25.1 Application Information
    2. 25.2 Typical Application
      1. 25.2.1 Design Requirements
      2. 25.2.2 Detailed Design Procedure
      3. 25.2.3 Application Curve
        1. 25.2.3.1 Insulation Lifetime
    3. 25.3 Power Supply Recommendations
    4. 25.4 Layout
      1. 25.4.1 Layout Guidelines
        1. 25.4.1.1 PCB Material
      2. 25.4.2 Layout Example
  27. 26Device and Documentation Support
    1. 26.1 Documentation Support
      1. 26.1.1 Related Documentation
    2. 26.2 Related Links
    3. 26.3 接收文档更新通知
    4. 26.4 支持资源
    5. 26.5 Trademarks
    6. 26.6 静电放电警告
    7. 26.7 术语表
  28. 27Revision History
  29. 28Mechanical, Packaging, and Orderable Information

24.1 Overview

The ISO7710-Q1 device has an ON-OFF keying (OOK) modulation scheme to transmit the digital data across a silicon dioxide based isolation barrier. The transmitter sends a high frequency carrier across the barrier to represent one digital state and sends no signal to represent the other digital state. The receiver demodulates the signal after advanced signal conditioning and produces the output through a buffer stage. The device also incorporates advanced circuit techniques to maximize the CMTI performance and minimize the radiated emissions due the high frequency carrier and IO buffer switching. The conceptual block diagram of a digital capacitive isolator, Figure 24-1, shows a functional block diagram of a typical channel.