ZHCSG31C
March 2017 – December 2024
ISO7710-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
6
Absolute Maximum Ratings
7
ESD Ratings
8
Recommended Operating Conditions
9
Thermal Information
10
Power Ratings
11
Insulation Specifications
12
Safety-Related Certifications
13
Safety Limiting Values
14
Electrical Characteristics—5-V Supply
15
Supply Current Characteristics—5-V Supply
16
Electrical Characteristics—3.3-V Supply
17
Supply Current Characteristics—3.3-V Supply
18
Electrical Characteristics—2.5-V Supply
19
Supply Current Characteristics—2.5-V Supply
20
Switching Characteristics—5-V Supply
21
Switching Characteristics—3.3-V Supply
22
Switching Characteristics—2.5-V Supply
23
Parameter Measurement Information
24
Detailed Description
24.1
Overview
24.2
Functional Block Diagram
24.3
Feature Description
24.3.1
Electromagnetic Compatibility (EMC) Considerations
24.4
Device Functional Modes
24.4.1
Device I/O Schematics
25
Application and Implementation
25.1
Application Information
25.2
Typical Application
25.2.1
Design Requirements
25.2.2
Detailed Design Procedure
25.2.3
Application Curve
25.2.3.1
Insulation Lifetime
25.3
Power Supply Recommendations
25.4
Layout
25.4.1
Layout Guidelines
25.4.1.1
PCB Material
25.4.2
Layout Example
26
Device and Documentation Support
26.1
Documentation Support
26.1.1
Related Documentation
26.2
Related Links
26.3
接收文档更新通知
26.4
支持资源
26.5
Trademarks
26.6
静电放电警告
26.7
术语表
27
Revision History
28
Mechanical, Packaging, and Orderable Information
26.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。