TIDT375 December   2023

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5. 1Test Prerequisites
    1. 1.1 Voltage and Current Requirements
    2. 1.2 Dimensions
    3. 1.3 Test Setup
  6. 2Testing and Results
    1. 2.1 Efficiency Graphs
    2. 2.2 Efficiency Data
    3. 2.3 Thermal Data
  7. 3Waveforms
    1. 3.1 Switching
    2. 3.2 Start-Up Sequence

2.3 Thermal Data

Figure 3-10 shows the thermal image. The heat sink has been removed and the applied load is 500 W.

GUID-20231130-SS0I-NLHF-XTWR-KCZZGGZBDWSP-low.png Figure 2-2 Thermal Image

FET temperatures were also measured with thermocouples. The heat sink and the thermal interface material (TIM) were applied for these measurements. The TIM used is LiPOLY T-work9000 with 1-mm thickness.

GUID-20231201-SS0I-R5X0-DPBQ-CP0Z7KTQ1BCF-low.jpgFigure 2-3 Thermocouple Data - Top Side Components
GUID-20231201-SS0I-PNQ3-GG4F-S9T8PVWVFS89-low.jpgFigure 2-4 Thermocouple Data - Bottom Side Components