SPRZ439H January   2017  – February 2024 TMS320F280040-Q1 , TMS320F280040C-Q1 , TMS320F280041 , TMS320F280041-Q1 , TMS320F280041C , TMS320F280041C-Q1 , TMS320F280045 , TMS320F280048-Q1 , TMS320F280048C-Q1 , TMS320F280049 , TMS320F280049-Q1 , TMS320F280049C , TMS320F280049C-Q1

 

  1.   1
  2.   TMS320F28004x Real-Time MCUs Silicon Errata (Silicon Revisions B, A, 0)
  3. 1Usage Notes and Advisories Matrices
    1. 1.1 Usage Notes Matrix
    2. 1.2 Advisories Matrix
  4. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  5. 3Silicon Revision B Usage Notes and Advisories
    1. 3.1 Silicon Revision B Usage Notes
      1. 3.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear
      2. 3.1.2 FPU32 and VCU Back-to-Back Memory Accesses
      3. 3.1.3 Caution While Using Nested Interrupts
      4. 3.1.4 Security: The primary layer of defense is securing the boundary of the chip, which begins with enabling JTAGLOCK and Zero-pin Boot to Flash feature
    2. 3.2 Silicon Revision B Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
      10.      Advisory
      11.      Advisory
      12.      Advisory
      13.      Advisory
      14.      Advisory
      15.      Advisory
      16.      Advisory
      17. 3.2.1 Advisory
      18.      Advisory
      19.      Advisory
      20.      Advisory
      21.      Advisory
      22. 3.2.2 Advisory
      23.      Advisory
      24.      Advisory
      25.      Advisory
      26.      Advisory
      27.      Advisory
      28. 3.2.3 Advisory
      29.      Advisory
      30.      Advisory
      31. 3.2.4 Advisory
  6. 4Silicon Revision A Usage Notes and Advisories
    1. 4.1 Silicon Revision A Usage Notes
    2. 4.2 Silicon Revision A Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
  7. 5Silicon Revision 0 Usage Notes and Advisories
    1. 5.1 Silicon Revision 0 Usage Notes
    2. 5.2 Silicon Revision 0 Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
  8. 6Documentation Support
  9. 7Trademarks
  10. 8Revision History

Advisory

SYSTEM: Multiple Successive Writes to CLKSRCCTL1 Can Cause a System Hang

Revisions Affected

0, A, B

Details

When the CLKSRCCTL1 register is written more than once without delay between writes, the system can hang and can only be recovered by an external XRSn reset or Watchdog reset. The occurrence of this condition depends on the clock ratio between SYSCLK and the clock selected by OSCCLKSRCSEL, and may not occur every time.

If this issue is encountered while using the debugger, then after hitting pause, the program counter will be at the Boot ROM reset vector.

Implementing the workaround will avoid this condition for any SYSCLK to OSCCLK ratio.

Workaround

Add a software delay of 300 SYSCLK cycles using an NOP instruction after every write to the CLKSRCCTL1 register.

Example:


ClkCfgRegs.CLKSRCCTL1.bit.INTOSC2OFF=0;         // Turn on INTOSC2
asm("  RPT #250 || NOP");                       // Delay of 250 SYSCLK Cycles
asm("  RPT #50 || NOP");                        // Delay of 50 SYSCLK Cycles
ClkCfgRegs.CLKSRCCTL1.bit.OSCCLKSRCSEL = 0;     // Clk Src = INTOSC2
asm("  RPT #250 || NOP");                       // Delay of 250 SYSCLK Cycles
asm("  RPT #50 || NOP");                        // Delay of 50 SYSCLK Cycles

C2000Ware_3_00_00_00 and later revisions will have this workaround implemented.