SPRUJ06 October   2021

 

  1.   Trademarks
  2. 1Introduction
  3. 2Revisions and Assembly Variants
  4. 3System Description
    1. 3.1 Key Features
    2. 3.2 Functional Block Diagram
    3. 3.3 Interfaces and Major Component Description
      1. 3.3.1 Breakout Board Section
      2. 3.3.2 IO-Link Section Overview and Major Component Description
        1. 3.3.2.1 IO Link Transceiver TIOL111DMWR
        2. 3.3.2.2 Smart Switch TPS4H160BQPWPRQ1
        3. 3.3.2.3 Serializer SN65HVS882
        4. 3.3.2.4 INA253
        5. 3.3.2.5 LED Driver TLC59282
        6. 3.3.2.6 Signal Routing
      3. 3.3.3 Power Section
        1. 3.3.3.1 Power Input
      4. 3.3.4 Board Mating Connections
  5. 4Known Issues
    1. 4.1 Issue 1: Voltage Spike Across the TX Line of the Transceiver

2 Revisions and Assembly Variants

The various TMDS64DC01EVM and TMDS243DC01EVM PCB design revisions and assembly variants are listed in the table below. Specific PCB revision is indicated in silkscreen on the PCB. Specific assembly variant is indicated with additional sticker label.

Table 2-1 TMDS64DC01EVM and TMDS243DC01EVM PCB Design Revisions and Assembly Variants
PCB Revision Assembly Variant Revision and Assembly Variant Description
PROC102E1 0011 First prototype, early release version of the AM64x EVM IO-Link and High Speed Expansion Board. Implements both the breakout and IO-Link sections of the board.
PROC102E1 002 First prototype, early release version of the AM243x EVM High Speed Expansion Board. Implements only the breakout section of the board.
PROC102A 0011 First production release of the AM64x EVM IO-Link and High Speed Expansion Board. Implements both the breakout and IO-Link sections of the board.
PROC102A 002 First production release of the AM243x EVM High Speed Expansion Board. Implements only the breakout section of the board.
  1. The TMDS64D01EVM E1 boards do not have a sticker indicating the '001' assembly variant.