SPRUJ06 October   2021

 

  1.   Trademarks
  2. 1Introduction
  3. 2Revisions and Assembly Variants
  4. 3System Description
    1. 3.1 Key Features
    2. 3.2 Functional Block Diagram
    3. 3.3 Interfaces and Major Component Description
      1. 3.3.1 Breakout Board Section
      2. 3.3.2 IO-Link Section Overview and Major Component Description
        1. 3.3.2.1 IO Link Transceiver TIOL111DMWR
        2. 3.3.2.2 Smart Switch TPS4H160BQPWPRQ1
        3. 3.3.2.3 Serializer SN65HVS882
        4. 3.3.2.4 INA253
        5. 3.3.2.5 LED Driver TLC59282
        6. 3.3.2.6 Signal Routing
      3. 3.3.3 Power Section
        1. 3.3.3.1 Power Input
      4. 3.3.4 Board Mating Connections
  5. 4Known Issues
    1. 4.1 Issue 1: Voltage Spike Across the TX Line of the Transceiver

3.3.1 Breakout Board Section

The general purpose Breakout board connects each pin of the High Speed Expansion (HSE) connector to eight, 2x10 test headers with 0.1” spacing between each pin. Additionally, the board features a circuit prototype area with standard 0.1” hole spacing.

Signals from the HSE connector are connected to the Breakout board or IO-Link section using FET switches. The FET switches are controlled using the J11 Header. Connecting the control signal of all the MUXes to ground routes all signals from the HSE connector to the Breakout board, whereas connecting the control signal to VCC3V3_IO_HSE routes all signals from the Mux to the IO-Link section.

Table 3-2 Functionality Selected by J11 Header
J11 Header Selection Functionality Supported Board
Short J11 pins 1 and 2 Selects IO-Link section TMDS64DC01EVM only
Short J11 pins 2 and 3 Selects Breakout board section TMDS64DC01EVM and TMDS243DC01EVM
GUID-4475141D-A596-4A87-B6E8-F28E9C718E7E-low.png Figure 3-3 Breakout Sectional Functional Block Diagram