SPRACL7 March   2019 AM5746 , AM5748 , AM5749

 

  1.   AM574x thermal considerations
    1.     Trademarks
    2. 1 Overview
    3. 2 Important Notes
    4. 3 Test Overview
      1. 3.1 OS Idle
      2. 3.2 Dhrystone
      3. 3.3 Temperature Measurement
      4. 3.4 OPP Definitions
    5. 4 Data and Results
      1. 4.1 OPP Settings and Linux Thermal Framework
      2. 4.2 Power and Thermal Chamber Measurements
      3. 4.3 OS Idle at OPP_NOM
      4. 4.4 Dhrystone 1 Core at OPP_NOM
      5. 4.5 Dhrystone 2 Core at OPP_NOM
      6. 4.6 Dhrystone 1 Core at OPP_HIGH
      7. 4.7 Dhrystone 2 Core at OPP_HIGH
    6. 5 References

2 Important Notes

The environmental chamber used to collect this data circulates air internally to maintain homogeneous internal temperature, and does not accurately simulate the environment on the bench or end product. This is important to consider in passive cooling applications where air circulation can significantly impact PCB, package, and heatsink power dissipation efficiency.

The data presented in this test is gathered with a typical device, representing nominal silicon process and leakage. Thermal performance and power consumption can vary significantly due to process variation. Extra margin must be designed in to account for worst case process variation (leakage).