SLVUDA6 February   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Getting Started
    1. 2.1 Introduction
    2. 2.2 Key Features
    3. 2.3 What's Included
      1. 2.3.1 Kit Contents
      2. 2.3.2 Software Examples
    4. 2.4 Connecting to the Computer
    5. 2.5 First Steps: Out of Box Experience (OoBE)
    6. 2.6 Next Steps: Looking Into the Provided Code
  7. 3Hardware
    1. 3.1 Jumper Map
    2. 3.2 Block Diagram
    3. 3.3 Hardware Features
      1. 3.3.1 MSPM0G3218 MCU
    4. 3.4 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      1. 3.4.1 Application (or Backchannel) UART
      2. 3.4.2 Using an External Debug Probe Instead of the Onboard XDS110-ET
      3. 3.4.3 Using the XDS110-ET Debug Probe With a Different Target
      4. 3.4.4 Special Features
        1. 3.4.4.1 Thermistor
    5. 3.5 Power
      1. 3.5.1 XDS110-ET USB Power
    6. 3.6 External Power Supply and BoosterPack Plug-in Module
    7. 3.7 Measure Current Draw of the MSPM0 MCU
    8. 3.8 Clocking
    9. 3.9 BoosterPack Plug-in Module Pinout
  8. 4Software Examples
  9. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  10. 6Resources
    1. 6.1 Integrated Development Environments
      1. 6.1.1 TI Cloud Development Tools
      2. 6.1.2 TI Resource Explorer Cloud
      3. 6.1.3 Code Composer Studio Cloud
      4. 6.1.4 Code Composer Studio IDE
    2. 6.2 MSPM0 SDK and TI Resource Explorer
    3. 6.3 MSPM0G3218 MCU
      1. 6.3.1 Device Documentation
      2. 6.3.2 MSPM0G3218 Code Examples
    4. 6.4 Community Resources
      1. 6.4.1 TI E2E™ Forums
  11. 7Additional Information
    1. 7.1 Trademarks
  12. 8Revision History

6.1.1 TI Cloud Development Tools

TI's Cloud-based software development tools provide instant access to MSPM0_SDK content and a web-based IDE.