SLVUDA6 February   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Getting Started
    1. 2.1 Introduction
    2. 2.2 Key Features
    3. 2.3 What's Included
      1. 2.3.1 Kit Contents
      2. 2.3.2 Software Examples
    4. 2.4 Connecting to the Computer
    5. 2.5 First Steps: Out of Box Experience (OoBE)
    6. 2.6 Next Steps: Looking Into the Provided Code
  7. 3Hardware
    1. 3.1 Jumper Map
    2. 3.2 Block Diagram
    3. 3.3 Hardware Features
      1. 3.3.1 MSPM0G3218 MCU
    4. 3.4 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      1. 3.4.1 Application (or Backchannel) UART
      2. 3.4.2 Using an External Debug Probe Instead of the Onboard XDS110-ET
      3. 3.4.3 Using the XDS110-ET Debug Probe With a Different Target
      4. 3.4.4 Special Features
        1. 3.4.4.1 Thermistor
    5. 3.5 Power
      1. 3.5.1 XDS110-ET USB Power
    6. 3.6 External Power Supply and BoosterPack Plug-in Module
    7. 3.7 Measure Current Draw of the MSPM0 MCU
    8. 3.8 Clocking
    9. 3.9 BoosterPack Plug-in Module Pinout
  8. 4Software Examples
  9. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  10. 6Resources
    1. 6.1 Integrated Development Environments
      1. 6.1.1 TI Cloud Development Tools
      2. 6.1.2 TI Resource Explorer Cloud
      3. 6.1.3 Code Composer Studio Cloud
      4. 6.1.4 Code Composer Studio IDE
    2. 6.2 MSPM0 SDK and TI Resource Explorer
    3. 6.3 MSPM0G3218 MCU
      1. 6.3.1 Device Documentation
      2. 6.3.2 MSPM0G3218 Code Examples
    4. 6.4 Community Resources
      1. 6.4.1 TI E2E™ Forums
  11. 7Additional Information
    1. 7.1 Trademarks
  12. 8Revision History

3.4 XDS110-ET Onboard Debug Probe With EnergyTrace Technology

To keep development easy and cost effective, TI’s LaunchPad development kits integrate an onboard debug probe, which eliminates the need for expensive programmers. The MSPM0G3218 has the XDS110 debug probe (see #IMAGE_C5G_TXV_VVB), which is a simple and low-cost debugger that supports all MSPM0 device derivatives.

LP-MSPM0G3210 LP-MSPM0G3218 DebuggerFigure 3-4 LP-MSPM0G3218 Debugger

The XDS110 ET also provides a "backchannel" UART-over-USB connection with the host, which can be very useful during debugging and for easy communication with a PC. More details can be found in Section 3.4.1.

The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the XDS110-ET domain into the MSPM0G3218 target domain. This includes XDS110-ET SWD signals, application UART signals, and 3.3V and 5V power.

Reasons to open these connections:

  • To remove any and all influence from the XDS110-ET debug probe for high accuracy target power measurements
  • To control 3.3V and 5V power flow between the XDS110-ET and target domains
  • To expose the target MCU pins for other use than onboard debugging and application UART communication
  • To expose the programming and UART interface of the XDS110-ET so that the programming and UART interface can be used for devices other than the onboard MCU.
JumperDescription
GNDGround
5 V5V VBUS from USB
3V33.3V rail, derived from VBUS in the XDS110-ET domain
RXD<<Backchannel UART: The target M0G3218 receives data through this signal. The arrows indicate the direction of the signal
TXD>>Backchannel UART: The target M0G3218 sends data through this signal. The arrows indicate the direction of the signal
NRSTRST signal
SWDIOSerial wire debug: SWDIO data signal.
SWCLKSerial wire debug: SWDCLK clock signal
BSLBootstrap loader signal