3 Device and Test Board Information

The OPA4H838-SEP is packaged in a 14-pin plastic TSSOP (PW) package. The AMP-PDK-EVM evaluation module (EVM) is used to evaluate the performance and characteristics of the OPA4H838-SEP under heavy ion radiation. The OPA4H838-SEP devices are decapsulated to reveal the bare die face for all heavy-ion testing. The device under test (DUT) is inserted into a socket into the AMP-PDK-EVM to test various units with the same EVM. The plastic supporting bar across the top of the socket lid is removed. Each device is configured in the buffer configuration (Buffer Section). For more information about the AMP-PDK-EVM evaluation module, click here.

Figure 3-1 Pinout Diagram

Figure 3-2 AMP-PDK-TSSOP-14 Socket

Figure 3-3 AMP-PDK-TSSOP-14 Socket - Plastic bar removed

Figure 3-4 AMP-PDK-EVM Evaluation Module Used for OPA4H838-SEP SEE Testing Top View

Figure 3-5 AMP-PDK-EVM Board