SLVK199A August   2025  – August 2026 TPS7H3024-SP , TPS7H3034-SP , TPS7H3134-SP

 

  1.   1
  2.   2
  3.   Trademarks
  4. 1 Introduction
  5. 2 Single-Event Effects (SEE)
  6. 3 Device and Test Board Information
  7. 4 Irradiation Facility and Setup
  8. 5 LETEFF and Range Calculation
  9. 6 Test Setup and Procedures
  10. 7 Destructive Single-Event Effects (DSEE)
    1. 7.1 Single-Event Latch-Up (SEL) Results
    2. 7.2 Single-Event Burnout (SEB) and Single-Event Gate Rupture (SEGR) Results
  11. 8 Single-Event Transients (SET)
  12. 9 Event Rate Calculations
  13. 10Summary
  14.   A References
  15.   B Revision History

3 Device and Test Board Information

The TPS7H3XX4-SP is packaged in a 22-pin CFP-HFT ceramic package. Figure 3-1 shows a delidded unit. The TPS7H3024EVM-CVAL and TPS7H3124EVM-CVAL were used to evaluate the performance and characteristics of the TPS7H3XX4-SP under heavy ion radiation and can be seen in Figure 3-2 and Figure 3-3. The configuration used during the heavy-ions test campaign is provided in Figure 3-4 and Figure 3-5 for TPS7H30X4-SP and TPS7H31X4-SP, respectively.

Photograph of Delidded TPS7H30X4-SP [Left] and Pinout Diagram [Right]Figure 3-1 Photograph of Delidded TPS7H30X4-SP [Left] and Pinout Diagram [Right]
Note: The package was delidded to reveal the die face for all heavy-ion testing.
TPS7H3024EVM-CVAL Top ViewFigure 3-2 TPS7H3024EVM-CVAL Top View
TPS7H3124EVM-CVAL Top View Figure 3-3 TPS7H3124EVM-CVAL Top View
TPS7H30x4EVM-CVAL Schematic for SEE TestingFigure 3-4 TPS7H30x4EVM-CVAL Schematic for SEE Testing
TPS7H31x4EVM-CVAL Schematic for SEE Testing Figure 3-5 TPS7H31x4EVM-CVAL Schematic for SEE Testing