SLVK075A May   2022  – April 2025 DP83561-SP

 

  1.   1
  2.   Single-Event Effects Test Report of the DP83561-SP Space grade (QMLV-RHA) 10/100/1000 Ethernet PHY
  3.   Trademarks
  4. 1Introduction
  5. 2Single-Event Effects
  6. 3Test Device and Evaluation Board Information
    1.     7
  7. 4Irradiation Facility and Setup
  8. 5Depth, Range, and LETEFF Calculation
  9. 6Test Setup and Procedures
  10. 7Single Event Effects (SEE)
    1. 7.1 Single-Event-Latchup (SEL)
    2. 7.2 Single Event Transients (SET)
  11. 8Summary
  12.   A References
  13.   B Revision History

3 Test Device and Evaluation Board Information

The DP83561-SP is packaged in a 64-pin, thermally-enhanced, dual-ceramic, flat pack package (CQFP) as shown in Figure 3-1. The DP83561EVM evaluation board was used to evaluate the performance and characteristics of the DP83561-SP under heavy-ions. Figure 3-3 shows the top views of the evaluation board used for the radiation testing. Refer to the DP83561EVM User Guide for the evaluation board schematics and layout design.

DP83561-SP HBE Package 64-Pin CQFP Top View Figure 3-1 HBE Package 64-Pin CQFP Top View
DP83561-SP Photograph of Pin Out Diagram [Top] and Delidded DP83561-SP [Bottom]
The package lid was removed to reveal the die face for all heavy ions testing.
Figure 3-2 Photograph of Pin Out Diagram [Top] and Delidded DP83561-SP [Bottom]
DP83561-SP DP83561-SP Board Top View with MAC Interface Breakout Board Figure 3-3 DP83561-SP Board Top View with MAC Interface Breakout Board