SLVK075A May   2022  – April 2025 DP83561-SP

 

  1.   1
  2.   Single-Event Effects Test Report of the DP83561-SP Space grade (QMLV-RHA) 10/100/1000 Ethernet PHY
  3.   Trademarks
  4. 1Introduction
  5. 2Single-Event Effects
  6. 3Test Device and Evaluation Board Information
    1.     7
  7. 4Irradiation Facility and Setup
  8. 5Depth, Range, and LETEFF Calculation
  9. 6Test Setup and Procedures
  10. 7Single Event Effects (SEE)
    1. 7.1 Single-Event-Latchup (SEL)
    2. 7.2 Single Event Transients (SET)
  11. 8Summary
  12.   A References
  13.   B Revision History

1 Introduction

The DP83561-SP is a high reliability gigabit ethernet PHY designed for the high-radiation environment of space. The DP83561-SP is a low power, fully featured physical layer transceiver with integrated PMD sub-layers to support 10BASE-Te, 100BASE-TX and 1000BASE-T Ethernet protocols. The DP83561-SP is designed for easy implementation of 10/100/1000Mbps Ethernet LANs in extremely hostile environments. The device interfaces to twisted pair media through an external transformer. This device interfaces to the MAC layer through Reduced GMII (RGMII) and MII. The following are some of the device features:

  • QML Class V (QMLV), RHA, SMD 5962-20216
  • Military temperature range: –55°C to 125°C
  • Radiation performance
    • RHA up to TID = 100krad(Si)
    • SEL Immune to LET = 121MeV× cm2 / mg
    • SEE Characterized to LET = 85MeV × cm2 /mg
  • Single Event Functional Interrupt (SEFI) monitor suite – monitor
    • IEEE PCS state machine monitors
    • ECC configuration register monitor
    • PLL lock monitor
    • On-chip temperature monitor
    • Pin-configurable automatic SEFI recovery
  • Fully compatible to IEEE802.3 1000BASE-T, 100BASE-TX and 10BASE-Te specifications
  • Low RGMII latency (Tx < 90ns, Rx < 290ns)
  • MAC interface: RGMII, MII

See the DP83561-SP Data Sheet for the full list of device features.

The device is Radiation Hardened by Design (RHBD), fabricated by Texas Instruments using a CMOS process, and is available in 64-pin Ceramic Quad Flat Pack (CQFP) package, with a 11mm × 11mm body size (nominal). Visit the DP83561-SP product page for more detailed technical specifications, user's guides, and application notes.

Table 1-1 Overview Information
DESCRIPTION (1)DEVICE INFORMATION (1)
TI Part NumberDP83561-SP
Orderable Name5962021601VXC
Device FunctionEthernet PHY Transceiver
TechnologyEthernet
Exposure FacilityRadiation Effects Facility, Cyclotron Institute, Texas A&M University
Irradiation Temperature25°C and 125°C (For SEL Testing)
(1) TI may provide technical, applications or design advice, quality characterization, and reliability data or service. Providing these items shall not expand or otherwise affect TI's warranties as set forth in the Texas Instruments Incorporated Standard Terms and Conditions of Sale for Semiconductor Products and no obligation or liability shall arise from Semiconductor Products and no obligation or liability shall arise from TI's provision of such items.