SLUUC27C June   2019  – July 2022 BQ25611D , BQ25619

 

  1.   BQ25611D, BQ25619 (BMS025) Evaluation Module
  2.   Trademarks
  3. 1Introduction
    1. 1.1 EVM Features
    2. 1.2 I/O Descriptions
  4. 2Test Summary
    1. 2.1 Equipment
    2. 2.2 Equipment Setup
    3. 2.3 Software Setup
    4. 2.4 Test Procedure
      1. 2.4.1 Initial Settings
      2. 2.4.2 Communication Verification
      3. 2.4.3 Charger Mode Verification
      4. 2.4.4 Boost Mode Verification
      5. 2.4.5 Evaluation Results
      6. 2.4.6 Helpful Tips
  5. 3PCB Layout Guideline
  6. 4Board Layout, Schematic, and Bill of Materials
    1. 4.1 Board Layout
    2. 4.2 Schematics
    3. 4.3 Bill of Materials
  7. 5Revision History

Board Layout

Figure 4-1 through Figure 4-8 illustrate the PCB board layouts.

GUID-3470B2A3-A1B5-4022-B12E-2FD026F9060B-low.gifFigure 4-1 BMS025 Rev. A Top Overlay
GUID-D5DDC132-046A-475D-AB68-EE6939B68F55-low.gifFigure 4-2 BMS025 Rev. A Top Solder Mask
GUID-F9630D92-464D-4142-880A-85DC3F9D1313-low.gifFigure 4-3 BMS025 Rev. A Top Layer
GUID-2E1474FB-6E48-4095-96DE-54DE03D99134-low.gifFigure 4-4 BMS025 Rev. A MidLayer 1
GUID-2EA4F784-DC61-4A7A-80C3-DD1A0CA3D842-low.gifFigure 4-5 BMS025 Rev. A MidLayer 2
GUID-53FA4EA3-13F4-4822-8CE9-931586712992-low.gifFigure 4-6 BMS025 Rev. A Bottom Layer
GUID-A95F8792-BF07-4C54-B94B-956504142B65-low.gifFigure 4-7 BMS025 Rev. A Bottom Solder Mask
GUID-1EB8734A-5944-475B-BCD2-4F9F9B3B190B-low.gifFigure 4-8 BMS025 Rev. A Bottom Overlay