ZHCSMW9
October 2021
DLP800RE
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
11
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
15
6.8
System Mounting Interface Loads
17
6.9
Micromirror Array Physical Characteristics
19
6.10
Micromirror Array Optical Characteristics
21
6.11
Window Characteristics
6.12
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Numerical Aperture and Stray Light Control
7.5.2
Pupil Match
7.5.3
Illumination Overfill
7.6
Mircomirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
7.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.7.2
Landed Duty Cycle and Useful Life of the DMD
7.7.3
Landed Duty Cycle and Operational DMD Temperature
7.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Temperature Sensor Diode
9
Power Supply Recommendations
9.1
DMD Power Supply Requirements
9.2
DMD Power Supply Power-Up Procedure
9.3
DMD Power Supply Power-Down Procedure
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.2.1
Layers
10.2.2
Impedance Requirements
10.2.3
Trace Width, Spacing
10.2.3.1
Voltage Signals
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.2
Device Markings
11.3
Documentation Support
11.3.1
Related Documentation
11.4
接收文档更新通知
11.5
支持资源
11.6
Trademarks
11.7
Electrostatic Discharge Caution
11.8
术语表
12
Mechanical, Packaging, and Orderable Information
12.1
Package Option Addendum
12.1.1
Packaging Information
封装选项
机械数据 (封装 | 引脚)
FYV|350
MCCC010
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsmw9_oa
1
特性
0.8
英寸对角线微镜阵列
WUXGA
(
1920 × 1200
) 显示分辨率
9.0µm 微镜间距
±14.5° 微镜倾斜度(相对于平坦表面)
角落照明
2xLVDS 输入数据总线
支持高达
120 Hz
的
WUXGA
分辨率
DLPC4430 display controller
、DLPA100 电源管理和电机驱动器 IC 为 LED、激光荧光体和 RGB 激光提供支持