ZHCSNR2 December   2021 DAC43508 , DAC53508

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: SPI
    7. 7.7  Timing Requirements: Logic
    8. 7.8  Timing Diagrams
    9. 7.9  Typical Characteristics: Static Performance
    10. 7.10 Typical Characteristics: Dynamic Performance
    11. 7.11 Typical Characteristics: General
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Update and LDAC Functionality
        3. 8.3.1.3 CLR Functionality
        4. 8.3.1.4 Output Amplifier
      2. 8.3.2 Reference
      3. 8.3.3 Power-On Reset (POR)
      4. 8.3.4 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
    6. 8.6 Register Map
      1. 8.6.1 DEVICE_CONFIG Register (address = 01h) [reset = 00FFh]
      2. 8.6.2 STATUS_TRIGGER Register (address = 02h) [reset = 0000h]
      3. 8.6.3 BRDCAST Register (address = 03h) [reset = 0000h]
      4. 8.6.4 DACn_DATA Register (address = 08h to 0Fh) [reset = 0000h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Programmable LED Biasing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Programmable Window Comparator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

  • ±1LSB INL 和 DNL
  • 宽工作范围
    • 电源：1.8V 至 5.5V
    • 温度范围：–40°C 至 +125°C
  • 3 线 SPI 接口
    • 2.7V ≤ VDD ≤ 5.5V 时，VIH = 2.4V
    • 1.8V ≤ VDD ≤ 2.7V 时，VIH = (VDD – 0.3V)
  • 通过 LDAC 引脚实现同步输出更新
  • 功耗极低：0.1mA/通道 (1.8V)
  • 低功耗启动模式：输出断电，并通过 10kΩ 连接至 AGND。
  • 微型封装
    • 16 引脚 WQFN (3mm × 3mm)