ZHCSNR2
December 2021
DAC43508
,
DAC53508
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configurations and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: SPI
7.7
Timing Requirements: Logic
7.8
Timing Diagrams
7.9
Typical Characteristics: Static Performance
7.10
Typical Characteristics: Dynamic Performance
7.11
Typical Characteristics: General
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Digital-to-Analog Converter (DAC) Architecture
8.3.1.1
DAC Transfer Function
8.3.1.2
DAC Register Update and LDAC Functionality
8.3.1.3
CLR Functionality
8.3.1.4
Output Amplifier
8.3.2
Reference
8.3.3
Power-On Reset (POR)
8.3.4
Software Reset
8.4
Device Functional Modes
8.4.1
Power-Down Mode
8.5
Programming
8.5.1
Serial Peripheral Interface (SPI)
8.6
Register Map
8.6.1
DEVICE_CONFIG Register (address = 01h) [reset = 00FFh]
8.6.2
STATUS_TRIGGER Register (address = 02h) [reset = 0000h]
8.6.3
BRDCAST Register (address = 03h) [reset = 0000h]
8.6.4
DACn_DATA Register (address = 08h to 0Fh) [reset = 0000h]
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Programmable LED Biasing
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
9.2.2
Programmable Window Comparator
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RTE|16
MPQF149D
散热焊盘机械数据 (封装 | 引脚)
RTE|16
QFND525B
订购信息
zhcsnr2_oa
12.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。