ZHCSCU6A June   2014  – September 2014 ULN2003B

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics, TA = 25°C
    6. 7.6  Electrical Characteristics, TA = -40°C to 105°C
    7. 7.7  Switching Characteristics, TA = 25°C
    8. 7.8  Switching Characteristics, TA = -40°C to 105°C
    9. 7.9  Typical Characteristics
    10. 7.10 Thermal Information
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Inductive Load Drive
      2. 9.4.2 Resistive Load Drive
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Drive Current
        2. 10.2.2.2 Output Low Voltage
        3. 10.2.2.3 Power Dissipation & Temperature
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 商标
    2. 13.2 静电放电警告
    3. 13.3 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Power Supply Recommendations

This part does not need a power supply; however, the COM pin is typically tied to the system power supply. When this is the case, it is very important to make sure that the output voltage does not heavily exceed the COM pin voltage. This will heavily forward bias the fly-back diodes and cause a large current to flow into COM, potentially damaging the on-chip metal or over-heating the part.