ZHCSCU6A June   2014  – September 2014 ULN2003B

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics, TA = 25°C
    6. 7.6  Electrical Characteristics, TA = -40°C to 105°C
    7. 7.7  Switching Characteristics, TA = 25°C
    8. 7.8  Switching Characteristics, TA = -40°C to 105°C
    9. 7.9  Typical Characteristics
    10. 7.10 Thermal Information
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Inductive Load Drive
      2. 9.4.2 Resistive Load Drive
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Drive Current
        2. 10.2.2.2 Output Low Voltage
        3. 10.2.2.3 Power Dissipation & Temperature
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 商标
    2. 13.2 静电放电警告
    3. 13.3 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

10.1 Application Information

ULN2003B will typically be used to drive a high voltage and/or current peripheral from an MCU or logic device that cannot tolerate these conditions. The following design is a common application of ULN2003B, driving inductive loads. This includes motors, solenoids & relays. Each load type can be modeled by what's seen in Figure 16.

10.2 Typical Application

relay_drv.gifFigure 16. ULN2003B as Inductive Load Driver

10.2.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
GPIO Voltage 3.3 V or 5.0 V
Coil Supply Voltage 12 V to 48 V
Number of Channels 7
Output Current (RCOIL) 20 mA to 300 mA per channel
Duty Cycle 100%

10.2.2 Detailed Design Procedure

When using ULN2003B in a coil driving application, determine the following:

  • Input Voltage Range
  • Temperature Range
  • Output & Drive Current
  • Power Dissipation

10.2.2.1 Drive Current

The coil current is determined by the coil voltage (VSUP), coil resistance & output low voltage (VOL or VCE(SAT)).

Equation 1. ICOIL = (VSUP – VCE(SAT)) / RCOIL

10.2.2.2 Output Low Voltage

The output low voltage (VOL) is the same thing as VCE(SAT) and can be determined by, Figure 1, Figure 2, or Figure 5.

10.2.2.3 Power Dissipation & Temperature

The number of coils driven is dependent on the coil current and on-chip power dissipation. The number of coils driven can be determined by Figure 6 or Figure 7.

For a more accurate determination of number of coils possible, use the below equation to calculate ULN2003B on-chip power dissipation PD:

Equation 2. eq1_lrs059.gif
Where:
N is the number of channels active together.
VOLi is the OUTi pin voltage for the load current ILi. This is the same as VCE(SAT)

In order to guarantee reliability of ULN2003B and the system the on-chip power dissipation must be lower that or equal to the maximum allowable power dissipation (PD(MAX)) dictated by below equation Equation 3.

Equation 3. eq2_lrs059.gif
Where:
TJ(MAX) is the target maximum junction temperature.
TA is the operating ambient temperature.
θJA is the package junction to ambient thermal resistance.

It is recommended to limit ULN2003B IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation.

10.2.3 Application Curves

The following curves were generated with ULN2003B driving an OMRON G5NB relay – Vin = 5.0V; Vsup= 12 V & RCOIL= 2.8 kΩ

D010_ULN2003B.gifFigure 17. Output Response With Activation of Coil (Turn On)
D009_ULN2003B.gifFigure 18. Output Response With De-activation of Coil (Turn Off)