ZHCSQH7E November   2021  – November 2024 TUSB2E11

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Version Comparison
    1. 4.1 Device Variants
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1  Repeater Mode
      2. 8.4.2  Power Down Mode
      3. 8.4.3  Disabled Mode
      4. 8.4.4  UART Mode
      5. 8.4.5  Auto-Resume ECR
      6. 8.4.6  L2 State Interrupt Modes
      7. 8.4.7  Attach Detect Interrupt Mode
      8. 8.4.8  GPIO Mode
      9. 8.4.9  USB 2.0 High-Speed HOST Disconnect Detection
      10. 8.4.10 Frame Based Low Power Mode
      11. 8.4.11 Battery Charging
    5. 8.5 Manufacturing Test Modes
      1. 8.5.1 USB DP Test Procedure
      2. 8.5.2 USB DM Test Procedure
    6. 8.6 I2C Target Interface
  10. 9 Register Access Protocol (RAP)
  11. 10Register Map
    1. 10.1 TUSB2E11 Registers
  12. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
      1. 11.3.1 Power Up Reset
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Example Layout for Application with 1.8V I2C Variant
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 Revision History

Changes from Revision D (April 2024) to Revision E (November 2024)

  • Added RAP address for writesGo

Changes from Revision C (January 2024) to Revision D (April 2024)

  • Added section on Frame Based low power modeGo
  • Added section on Battery ChargingGo
  • Added offset 0xB5 to the register mapGo

Changes from Revision B (August 2023) to Revision C (January 2024)

  • Changed I2C 7-bit target address from: 0x5E to: 0x3EGo

Changes from Revision A (June 2022) to Revision B (August 2023)

  • 更新了封装信息 表以包含封装引线尺寸Go
  • Clarify ROC for RESETBGo
  • Updated register F5h to indicate OPN variants.Go

Changes from Revision * (November 2021) to Revision A (June 2022)

  • 首次公开发布数据表Go