ZHCSQH7E November   2021  – November 2024 TUSB2E11

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Version Comparison
    1. 4.1 Device Variants
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1  Repeater Mode
      2. 8.4.2  Power Down Mode
      3. 8.4.3  Disabled Mode
      4. 8.4.4  UART Mode
      5. 8.4.5  Auto-Resume ECR
      6. 8.4.6  L2 State Interrupt Modes
      7. 8.4.7  Attach Detect Interrupt Mode
      8. 8.4.8  GPIO Mode
      9. 8.4.9  USB 2.0 High-Speed HOST Disconnect Detection
      10. 8.4.10 Frame Based Low Power Mode
      11. 8.4.11 Battery Charging
    5. 8.5 Manufacturing Test Modes
      1. 8.5.1 USB DP Test Procedure
      2. 8.5.2 USB DM Test Procedure
    6. 8.6 I2C Target Interface
  10. 9 Register Access Protocol (RAP)
  11. 10Register Map
    1. 10.1 TUSB2E11 Registers
  12. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
      1. 11.3.1 Power Up Reset
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Example Layout for Application with 1.8V I2C Variant
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD3V3 Supply voltage (VDD3V3) 3.0 3.3 3.6 V
VDD1V8 Analog Supply voltage (VDD1V8) 1.62 1.8 1.98 V
V_I2C_Pullup  I2C and GPIO open drain Bus Voltage (1.2 V Variant) 1.08 1.2 1.32 V
V_I2C_Pullup  I2C and GPIO open drain Bus Voltage (1.8 V Variant) 1.62 1.8 1.98 V
USB Voltage DP, DN 0 3.6 V
eUSB2 voltage eDP, eDN 0 1.32 V
Digital voltage GPIO0, GPIO1, GPIO2, SCL, SDA (1.8 V Variant) 0 1.98 V
Digital voltage GPIO0, GPIO1, GPIO2, SCL, SDA (1.2 V Variant) 0 1.32 V
RESETB RESETB (1.2 V or 1.8 V Variant)  0 1.98 V
TA Operating free-air temperature −20 85 °C
TJ Junction temperature −20 105 °C
TCASE Case temperature −20 105 °C
TPCB PCB temperature (1 mm away from the device)  −20 92 °C