ZHCSJR6B SEPTEMBER   2004  – October 2019 TS3L110

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     逻辑图（正逻辑）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dynamic Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • DBQ|16
  • RGY|16
  • D|16
  • DGV|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.7 Dynamic Characteristics

over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP(1) UNIT
XTALK RL = 100 Ω, f = 250 MHz, See Figure 7 –26 dB
OIRR RL = 100 Ω, f = 250 MHz, See Figure 8 –28 dB
BW RL = 100 Ω, See Figure 6 500 MHz
(1) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.