ZHCSJI3H March   2007  – August 2022 TS3A24159

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for 3-V Supply
    6. 6.6  Electrical Characteristics for 2.5-V Supply
    7. 6.7  Electrical Characteristics for 1.8-V Supply
    8. 6.8  Switching Characteristics for a 3-V Supply
    9. 6.9  Switching Characteristics for a 2.5-V Supply
    10. 6.10 Switching Characteristics for a 1.8-V Supply
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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Power Supply Recommendations

  • Proper power-supply sequencing is recommended for all CMOS devices.
  • Do not exceed the absolute maximum ratings, because stresses beyond the listed ratings can cause permanent damage to the device.
  • Always sequence VCC on first, followed by NO or COM.
  • Although it is not required, power-supply bypassing improves noise margin and prevents switching noise propagation from the VCC supply to other components.
  • A 0.1-μF capacitor, connected from VCC to GND, is adequate for most applications.