ZHCSUS9D 数据表 | 德州仪器 TI.com.cn

ZHCSUS9D June 2007 – February 2024 TRS232E

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		D (SOIC)	DW (SOIC)	N (PDIP)	PW (TSSOP)	UNIT
THERMAL METRIC⁽¹⁾		16 PINS	16 PINS	16 PINS	16 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	84.6	71.7	60.6	107.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	43.5	37.4	48.1	38.4	°C/W
R_θJB	Junction-to-board thermal resistance	43.2	36.8	40.6	53.7	°C/W
ψ_JT	Junction-to-top characterization parameter	10.4	13.	27.5	3.2	°C/W
ψ_JB	Junction-to-board characterization parameter	42.8	36.4	40.3	53.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.