ZHCSGB1C March   2013  – December 2019 TPS84A20

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用
  4. 4 修订历史记录
  5. 5 Ordering Information
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Package Specifications
    4. 6.4 Electrical Characteristics
    5. 6.5 Thermal Information
  7. 7 Device Information
    1. 7.1      Functional Block Diagram
    2. Table 1. Pin Descriptions
  8. 8 Typical Characteristics (PVIN = VIN = 12 V)
  9. 9 Typical Characteristics (PVIN = VIN = 5 V)
  10. 10Typical Characteristics (PVIN = 3.3 V, VIN = 5 V)
  11. 11Application Information
    1. 11.1  Adjusting the Output Voltage
    2. 11.2  Capacitor Recommendations for the TPS84A20 Power Supply
      1. 11.2.1 Capacitor Technologies
        1. 11.2.1.1 Electrolytic, Polymer-Electrolytic Capacitors
        2. 11.2.1.2 Ceramic Capacitors
        3. 11.2.1.3 Tantalum, Polymer-Tantalum Capacitors
      2. 11.2.2 Input Capacitor
      3. 11.2.3 Output Capacitor
    3. 11.3  Transient Response
    4. 11.4  Transient Waveforms
    5. 11.5  Application Schematics
    6. 11.6  VIN and PVIN Input Voltage
    7. 11.7  3.3 V PVIN Operation
    8. 11.8  Power Good (PWRGD)
    9. 11.9  Light Load Efficiency (LLE)
    10. 11.10 SYNC_OUT
    11. 11.11 Parallel Operation
    12. 11.12 Power-Up Characteristics
    13. 11.13 Pre-Biased Start-Up
    14. 11.14 Remote Sense
    15. 11.15 Thermal Shutdown
    16. 11.16 Output On/Off Inhibit (INH)
    17. 11.17 Slow Start (SS/TR)
    18. 11.18 Overcurrent Protection
    19. 11.19 Synchronization (CLK)
    20. 11.20 Sequencing (SS/TR)
    21. 11.21 Programmable Undervoltage Lockout (UVLO)
    22. 11.22 Layout Considerations
    23. 11.23 EMI
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息
    1. 13.1 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RVQ|42
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.22 Layout Considerations

To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 45 through Figure 48, shows a typical PCB layout. Some considerations for an optimized layout are:

  • Use large copper areas for power planes (PVIN, VOUT, and PGND) to minimize conduction loss and thermal stress.
  • Place ceramic input and output capacitors close to the device pins to minimize high frequency noise.
  • Locate additional output capacitors between the ceramic capacitor and the load.
  • Keep AGND and PGND separate from one another.
  • Place RSET, RRT, and CSS as close as possible to their respective pins.
  • Use multiple vias to connect the power planes to internal layers.
TPS84A20 Layout Top.pngFigure 45. Typical Top-Layer Layout
TPS84A20 Layout L3.pngFigure 47. Typical Layer 3 Layout
TPS84A20 Layout Layer2.pngFigure 46. Typical Layer-2 Layout
TPS84A20 Layout Bot.pngFigure 48. Typical Bottom-Layer Layout