ZHCSLB3B April   2020  – May 2025 TPS7B84-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Enable (EN)
      2. 6.3.2 Undervoltage Lockout
      3. 6.3.3 Thermal Shutdown
      4. 6.3.4 Current Limit
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Selection
      2. 7.1.2 Adjustable Device Feedback Resistor Selection
      3. 7.1.3 Feed-Forward Capacitor (CFF)
      4. 7.1.4 Dropout Voltage
      5. 7.1.5 Reverse Current
      6. 7.1.6 Power Dissipation (PD)
        1. 7.1.6.1 Thermal Performance Versus Copper Area
        2. 7.1.6.2 Power Dissipation vs Ambient Temperature
      7. 7.1.7 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Capacitor
        2. 7.2.2.2 Output Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package Mounting
        2. 7.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCY|4
  • DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) (2) TPS7B84-Q1 Unit
DRB (VSON) DCY
8 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance(3) 50.8 85.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 55.6 46.6 °C/W
RθJB Junction-to-board thermal resistance 22.9 11.3 °C/W
ψJT Junction-to-top characterization parameter 1.2 4.9 °C/W
ψJB Junction-to-board characterization parameter 22.9 11 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.5 11 °C/W
(1) The thermal data is based on the JEDEC standard high K profile,JESD 51-7. Two-signal, two-plane, four-layer board with 2-oz. copper. The copper pad is soldered tothe thermal land pattern. Also, correct attachment procedure must be incorporated.
(2) For more information about traditional and new thermal metrics,see the Semiconductor and IC PackageThermal Metrics application report.
(3) The 1s0p RθJA is 212.7℃/W for the DRB package and 168.8℃/W for the DCY package.