ZHCSU65D February   2010  – June 2025 TPS73801

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Adjustable Operation
      2. 6.3.2 Fixed Operation
      3. 6.3.3 Overload Recovery
      4. 6.3.4 Output Voltage Noise
      5. 6.3.5 Protection Features
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Output Capacitance and Transient Response
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Considerations
          1. 7.4.1.1.1 Calculating Junction Temperature
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

  1. For best performance, all traces must be as short as possible.
  2. Use wide traces for IN, OUT, and GND to minimize the parasitic electrical effects.
  3. A minimum output capacitor of 10 μF with an ESR of 3 Ω or less is recommended to prevent oscillations. X5R and X7R dielectrics are preferred.
  4. Place the output capacitor as close as possible to the OUT pin of the device.
  5. The tab of the DCQ package must be connected to ground.