ZHCSIE2M June   2008  – June 2018 TPS735

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     典型应用
  4. 4 修订历史记录
    1.     Pin Configuration and Functions
      1.      Pin Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Internal Current Limit
      2. 6.3.2 Shutdown
      3. 6.3.3 Dropout Voltage
      4. 6.3.4 Start-Up and Noise Reduction Capacitor
      5. 6.3.5 Transient Response
      6. 6.3.6 Undervoltage Lockout
      7. 6.3.7 Minimum Load
      8. 6.3.8 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Input and Output Capacitor Requirements
        2. 7.2.1.2 Feed-Forward Capacitor Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Noise
      3. 7.2.3 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 9.2 Layout Example
    3. 9.3 Power Dissipation
    4. 9.4 Estimating Junction Temperature
    5. 9.5 Package Mounting
  10. 10器件和文档支持
    1. 10.1 器件支持
      1. 10.1.1 开发支持
        1. 10.1.1.1 评估模块
      2. 10.1.2 器件命名规则
    2. 10.2 文档支持
      1. 10.2.1 相关文档
    3. 10.3 商标
    4. 10.4 静电放电警告
    5. 10.5 术语表
  11. 11机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from L Revision (January 2015) to M Revision

  • 根据最新产品说明书和翻译标准更新了产品说明书文本Go
  • Changed 在文档标题中将“超低噪声”更改成了“低噪声”Go
  • Changed 将低 IQ 从 46μA 更改成了 45μA（在特性、说明 和应用信息 部分中）Go
  • Changed 将特性 列表中的“标准”更改成了“陶瓷”Go
  • Changed 在特性 列表中将 6 引脚封装从“SON”更改成了“WSON”Go
  • Deleted 从 应用 部分中删除了“打印机、WiFi®、WiMax 模块、手机、智能手机和微处理器电源”Go
  • Added 在应用 部分中添加了“后直流/直流纹波滤除、IP 网络摄像机、大型基站和恒温器”Go
  • Changed 将 TA 更改成了 TJ（在说明 部分中）Go
  • Changed 在说明 部分中将 6 引脚封装从“SON”更改成了“WSON”Go
  • Changed 在器件信息 表中将封装从 VSON (6) 更改成了 WSON (6)Go
  • Changed 6-pin DRB package designator from "VSON" to "SON" in Pin Configurations and Functions section Go
  • Changed 6-pin DRV package designator from "VSON" to "WSON" in Pin Configurations and Functions section Go
  • Added "feedback resistor" parameter to Recommended Operating Conditions tableGo
  • Changed DRV package designator from "VSON" to "WSON" in Thermal Information table Go
  • Changed DRB package designator from "VSON" to "SON" in Thermal Information table Go
  • Changed TPS735 Ground Pin Current (Disable) vs Temperature in Typical Characteristics sectionGo
  • Changed TPS735 Dropout Voltage vs Output Current in Typical Characteristics sectionGo
  • Updated Equation 1 Go
  • Changed x-axis scale from "10 ms/div" to "10 µs/div" in Figure 17Go
  • Changed x-axis scale from "10 ms/div" to "10 µs/div" in Figure 18Go
  • Changed VOUT starting value to 0 V in Figure 19Go
  • Updated Equation 2 Go
  • Updated Equation 3 Go
  • Changed DRV package designator from "SON" to "WSON" in Measuring Points for TT and TBGo
  • Deleted 在相关文档 部分中删除了对热性能信息文档的引用Go

Changes from K Revision (August, 2013) to L Revision

  • Added 添加了 ESD 额定值 表、特性 说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、 布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • Added 在特性 列表中添加了第一个项目Go
  • Changed 将特性 列表中的第四个项目更改成了“1.2V 固定输出”Go
  • Changed 更改了特性 列表中的第八个项目Go
  • Changed 更改了特性 列表中的最后一个项目Go
  • Changed 更改了最后一个应用 列表项Go
  • Changed Pin Configuration and Functions section; updated table format and pin descriptions to meet new standards Go
  • Changed CNR value notation from 0.01 µF to 10 nF throughout Electrical CharacteristicsGo
  • Changed feedback voltage parameter values and measured test conditions Go
  • Changed output current limit maximum specified value Go
  • Changed power-supply rejection ratio typical specified values for 100 Hz, 10 kHz, and 100 kHz frequency test conditions Go
  • Added note (1) to Figure 1Go
  • Changed y-axis title for Figure 6Go
  • Changed y-axis title for Figure 7Go
  • Changed footnote for Figure 13Go
  • Changed reference to noise-reduction capacitor (CNR) to feed-forward capacitor (CFF) in Transient ResponseGo
  • Changed noise-reduction capacitor to feed-forward capacitor in Figure 16Go
  • Changed references to "noise-reduction capacitor" (CNR) to "feed-forward capacitor" (CFF) and section title from "Feedback Capacitor Requirements" to "Feed-forward Capacitor Requirements" in Feed-Forward Capacitor Requirements sectionGo
  • Changed CNR value notation from 0.01 µF to 10 nF in Output Noise sectionGo

Changes from J Revision (May, 2011) to K Revision

  • Added last sentence to first paragraph of Startup and Noise Reduction Capacitor sectionGo

Changes from I Revision (April, 2011) to J Revision

Changes from H Revision (November, 2009) to I Revision

Changes from G Revision (March 2009) to H Revision

  • 修订了特性 列表中的项目，以显示 280mV 的极低压降Go
  • Changed dropout voltage typical specification from 250mV to 280mVGo