ZHCSQV6
june 2023
TPS6521905
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
System Control Thresholds
6.6
BUCK1 Converter
6.7
BUCK2, BUCK3 Converter
6.8
General Purpose LDOs (LDO1, LDO2)
6.9
General Purpose LDOs (LDO3, LDO4)
6.10
GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
6.11
Voltage and Temperature Monitors
6.12
I2C Interface
6.13
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power-Up Sequencing
7.3.2
Power-Down Sequencing
7.3.3
Push Button and Enable Input (EN/PB/VSENSE)
7.3.4
Reset to SoC (nRSTOUT)
7.3.5
Buck Converters (Buck1, Buck2, and Buck3)
7.3.6
Linear Regulators (LDO1 through LDO4)
7.3.7
Interrupt Pin (nINT)
7.3.8
PWM/PFM and Low Power Modes (MODE/STBY)
7.3.9
PWM/PFM and Reset (MODE/RESET)
7.3.10
Voltage Select pin (VSEL_SD/VSEL_DDR)
7.3.11
General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
7.3.12
I2C-Compatible Interface
7.3.12.1
Data Validity
7.3.12.2
Start and Stop Conditions
7.3.12.3
Transferring Data
7.4
Device Functional Modes
7.4.1
Modes of Operation
7.4.1.1
OFF State
7.4.1.2
INITIALIZE State
7.4.1.3
ACTIVE State
7.4.1.4
STBY State
7.4.1.5
Fault Handling
7.5
User Registers
7.6
Device Registers
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Typical Application Example
8.2.2
Design Requirements
8.2.3
Detailed Design Procedure
8.2.3.1
Buck1, Buck2, Buck3 Design Procedure
8.2.3.2
LDO1, LDO2 Design Procedure
8.2.3.3
LDO3, LDO4 Design Procedure
8.2.3.4
VSYS, VDD1P8
8.2.3.5
Digital Signals Design Procedure
8.3
Multi-PMIC Operation
8.4
NVM Programming
8.4.1
TPS6521905 default NVM settings
8.4.2
NVM programming in Initialize State
8.4.3
NVM Programming in Active State
8.5
Application Curves
8.6
Power Supply Recommendations
8.7
Layout
8.7.1
Layout Guidelines
8.7.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
静电放电警告
9.6
术语表
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RSM|32
MPQF195B
RHB|32
MPQF130D
散热焊盘机械数据 (封装 | 引脚)
RSM|32
QFND112H
RHB|32
QFND676
订购信息
zhcsqv6_oa
9.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。